Posted On: February 9th, 2024 | By: Jason Farrell

SPIE Photonics West 2024

Indium Corporation® featured our Precision Au-Based Die-Attach Preforms at SPIE Photonics West 2024, the world’s premier event for...

Posted On: January 16th, 2024 | By: Dean Payne

Sinter material for power electronics - copper's time to shine?

In recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach......

Posted On: December 19th, 2022 | By: Jenny Gallery

Which Off-Eutectic AuSn Alloy Do I Use?

Plating dies and/or substrates with pure gold works well to prevent the components from oxidizing, but can lead to undesirable gold-rich solder joints...

Posted On: November 9th, 2022 | By: Dean Payne

A Discussion with 3D InCites on e-Mobility Challenges

Just last month at the IMAPS show in Boston, Sze Pei Lim and I had the opportunity to chat with Francoise von Trapp from 3D InCites to discuss materia...

Posted On: June 1st, 2022 | By: Jenny Gallery

IMS 2022!

The International Microwave Symposium (IMS) (June 21-23) is the premier annual international meeting for technologists involved in all aspec...

Posted On: August 10th, 2020 | By: Jenny Gallery

What the Off-Eutectic?

Indium Corporation's new off-eutectic alloy preforms ensure strong solder joints in a plethora of device and package hardware. Our off-eutectic Au...

Posted On: June 1st, 2020 | By: Jenny Gallery

That's a 'Fine' Ribbon You Got There!

Indium Corporation has developed 80Au20Sn < 0.1” wide fine-grade precision ribbon for high volume, fully automated laser diode assembly proce...

Posted On: March 11th, 2020 | By: Jenny Gallery

Why Do We Need to Go Thinner?

Indium Corporation has developed a thinner gold preform for high-output lasers, therefore improving the thermal transfer and operational efficiency of...