Package-on-Package (PoP) Solder Paste
A quick trip to discuss roadmapping with one of the world’s top processor manufacturers, and a visit to discuss Pb-free power die-attach materia...
A quick trip to discuss roadmapping with one of the world’s top processor manufacturers, and a visit to discuss Pb-free power die-attach materia...
My friend and colleague, Eric Bastow, got back last month from an IPC standards meeting with some interesting news for those of us who supply and use ...
Solderspheres or solder spheres, or even solder balls: whatever you call them, Indium Corporation has been making them for years and has rightly acqui...
I mentioned in a previous a blog posting that the primary driver for halogen-free electronics is ostensibly environmental, but that the confusion abou...
I love watching a good basketball game, and one of my favorite local teams is the Syracuse Orangemen. If you go to a Syracuse home game, notice.....
Those of you have been watching this blog for a while will know that I’ve been keeping tabs on the status of the European ELV (End-of-life vehic...
Today I made my rounds in the office, collecting ideas for you from our tech guys – ideas to help you speed the alloy and flux s...
The use of gold layers deposited onto nickel is standard in many industries, from DRAM memory module edge connectors, to electrical test probe co...
Materials to be used in packaging of high power semiconductor devices are often chosen by their coefficient of thermal expansion, or CTE. For ins...
Dr Jennie Hwang I recently had the opportunity to discuss several issues in Pb-free die-attach and other solder applications with Jennie Hwang Ph...
The junction temperature in an LED (the p-n junction temperature) is most critical to consider for LED cooling. If this temperature rises above t...