ELV Legislation Update (I)
Under-the-Hood: The “Death Valley” of Power Electronics New insights in April into changes in the European ELV (End-of-life vehi...
Under-the-Hood: The “Death Valley” of Power Electronics New insights in April into changes in the European ELV (End-of-life vehi...
Solder Die Attach Image Courtesy of memsonics.com The clock is ticking before the extension of Pb-free legislation for high Pb-containi...
After transferring flux, align the stencil Setup print parameters to minimize doubles and......
The Insulated Gate Bipolar Transistor (IGBT) module is rapidly taking over from MOSFET technology as the solid-state power switch of choice. Die-attac...
The folks at Advanced Packaging magazine asked Indium Corporation for its predictions for the Standard Semiconductor and Power Semiconductor packaging...
Diagram of Solder-Dipping Test Apparatus Solder-wetting Curve ......
A recent interview with Andy Mackie,(Ph.D., Indium Corporation)in Advanced Packaging Magazine helped shed some light......
Rick Short shaving my head for charity So why Blog? Whatever I choose to call this thing that you are currently reading, it’s a Blog. But what.....
A small selection of our Pb-free solder alloys In possibly one of the quietest revolutions in the history of Power Semiconductor electronics manufactu...
Welcome to the Power Semiconductor Assembly Blog, Indium Corporation’s information watercooler for the Power Semiconductor assembly industry. So...
Seth Homer is a Product Support Specialist for Engineered Solder Materials. He’s like a Green Beret or Navy Seal of solder preforms...
Etched Indium Ribbon Wound Back on Itself and cold-welded to form a loop. Die assembly often involves......