An Interview with Michael Qiu 采访邱学丞
Michael Qiu of Indium Corporation f eqn="sum 0 1 0"></f><f eqn="sum 0 0 1">f eqn="prod 2 1 2">&...
Michael Qiu of Indium Corporation f eqn="sum 0 1 0"></f><f eqn="sum 0 0 1">f eqn="prod 2 1 2">&...
Anyone working with BGA solder joint reliability should be used to X-ray detection, made possible by Si-Li and Ge-Li......
Unacceptable voiding under a die With less voiding under a power die, more heat can be dissipated through the solder into......
We are looking into a way to deposit solder on a typical die attach machine without using die-attach paste – and without a tooling change. This...
Soft solders are used instead of hard solders in applications were there are large coefficient of thermal expansion mismatches between semiconductor d...
If you need me to troubleshoot your ball attach process, PoP process, flip-chip assembly process, or die-attach process, I’d be happy to come an...
The picture shows a “Dispensing Component Kit”. I find this is extremely helpful in quickly verifying your powder/needle combination. This...
Conductive epoxy is a polymer matrix with flakes of silver mixed into it. These silver flakes span a distance of about 40 microns or less. The silver....