Driving the Packaging Frontier: Part 2
Indium Corporation’s Sze Pei Lim, talks about when to make th emove from water-soluble to no-clean fluxes for flip-chip assembly packages....
Dr. Andy Mackie's Blog
Driving the Packaging Frontier: Part 1
Indium Corporation’s Dr. Andy Mackie, Senior Product Manager, Semiconductor and Advanced Assembly Materials, and Sze Pei Lim, Regional Manager, ...
InForms® for Improved Power Device Reliability
Exploring the many benefits of InForm® soldering technology....
Evolving Semiconductor Assembly Challenges in 2019
2019 predictions for semiductor packaging and assembly based on global uncertainty on political and economic fronts....
Power Consumption for Electric Vehicles (EV)
Some thoughts about the growth of electric vehicles (EV) and their power requirements. How much electrical power would it take to convert 10...
How Clean is Clean?
When you focus on trying to quantify the level of contaminating material that remains after the cleaning process, you leave the more important questio...
Avoid the Void®: Voiding in High-Temperature Soldering
Gold-tin eutectic solder can be used as the second-step solder, after the initial die-attach step. ...
Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms
Voiding is a major problem in electronics assembly, especially in high-temp applications ...
Avoid the Void®: Voiding in Gold-Tin (AuSn20) Solder Joints
Using gold-tin solder in high-temp applications for both high-temperature and LED applications, there's been an increase in voiding which may corr...
Gold-Tin Eutectic Solder
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high...
One-Step Soldering in Flip-Chip Assembly
This video is for anyone interested in flip-chip/BGA balling using the one-step assembly process. Keywords: Phil Zarrow, Andy Mackie, amackie@indium.c...
Flux Challenges Regarding Flip-Chip/BGA Balling
This video is for anyone interested in the flux challenges associated with flip-chip/BGA balling. Keywords: Phil Zarrow, Andy Mackie, Indium Corporati...