Universal Technology Update; Is your process biased?
At what point in new product development does the solder get updated with the rest of......
Indium Alloy
A Liquid Metals Handling Update
Have you seen the statement on Indium’s product data sheet for liquid metals that says: “Care should be taken in reheating the alloy in th...
Alloy Thermal Conductivity
Calculating the thermal conductivity of an alloy is not done by taking an average (or weighted average) of its elemental constituents. When two metals...
How Low Can You Go?
Due to the limitations of flux, there is bottom end temperature where traditional solder/flux bonding ends. The lowest temperature I have experienced ...
Thermal Interface Materials for Extreme Conditions
The most common metal thermal interface materials are made from indium alloys which melt between 100C to 200C. Some power devices I have come across d...
Head-in-Pillow Defects 4: Material Issues
Head-in-pillow defects related to solder paste or flux performance are classified as Materials Issues. These include poor transfer efficiency on stand...
Research Solder Kits
I recently read an article at Development Monkey by Karen Field about how Development Kits are growing in popularity with Design Engineers. She report...
Indium Alloy Wetting For Flip Chip Applications
Here is some data to compare the relative spread of indium based alloys on copper. Notice the difference between the old and new lots of 90In/10Ag. ...
“There’s an ‘L’ in solder?”
This question was posed to me while introducing a family member to the world of Engineered Solders this past weekend. While I was still reeling from t...
Design Options for Metal Thermal Interface Materials in LEDs
With the Strategies in Light show just behind us, I thought it a good time to discuss a little further the use of metal thermal interface materials......
Indium Corporation Wall Chart
Do you have a 2’ x 3’ area on the wall of your office or cubical for the latest new and improved Indium Corporation Wall Chart? a......
Soldering Basics
A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins wit...