NanoBond® is a Room Temperature Bonding Process
As I mentioned in an earlier post, some soldering applications require a fluxless process. In this line of work you see an assortment of odd soldering...
As I mentioned in an earlier post, some soldering applications require a fluxless process. In this line of work you see an assortment of odd soldering...
This month’s nanotechnology post comes from the Electronic Privacy Information Center. Today I thought I’d share one of the most personall...
At the SVC (Society of Vacuum Coaters) conference this year, I spoke about setting a “zero stress” temperature during target bonding. I&rs...
An important quote from Eliminating Bond Stresses of Sputtering Targets at Operating Temperatures is: “This suggests that a target bonded at one...
If you’re looking to catch up on the latest developments in CPV here’s a free event in which you can take part from the comfort of your of...
We have observed that the temperature at which two materials are bonded will set the base temperature that any subsequent CTE is measured from. T...
Coefficient of Thermal Expansion (CTE) differences between materials can really cause problems when those materials are rigidly bonded. If you’v...
“The standard process was used as described: The pieces were assembled with a reactive multilayer foil between the aluminum and molybdenum, with...
A traditionally bonded sputtering target experiences a wide range of temperatures over its life cycle. It is bonded at over 200°C – usually ...
Why do we care so much about target bonding? This is important because a sputtering target that truly performs will allow greater process flexibility,...
Whenever two materials with different coefficient of thermal expansion values are bonded together, they will expand and contract as the temperature ch...
Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux...