Package-on-Package Solder Paste for a High Yield Process
From a mechanical perspective, larger solder joints are generally preferred when assembling package-on-package (PoP) components. Just as ...
From a mechanical perspective, larger solder joints are generally preferred when assembling package-on-package (PoP) components. Just as ...
Folks, Since 2002 SMTA has had an SMT Process Engineer Certification Program that was developed by Jim Hall, Phil Zarrow and me. Some folks are ...
Wafer fluxes seem pretty simple, just some liquid that helps form bumps on an electroplated wafer. The truth......
If you have been hoping that you current BGA process doesn’t fall victim to non-wets, it’s time to gain......
Surprises are rarely a good thing in production. High quality spheres minimize those ‘surprises’ when building BGAs and......
Folks, Well, I arrived at SMTAI a few days early to take my wife, daughter and two granddaughters to Disney World. We averaged 7 miles of w...
As mentioned last week, we are holding another Meet The Bloggers at SMTAI on Aug. 20th. If you are......
We had a pretty good turnout at Semicon West 2008 with our first “Meet the Bloggers” event, so we decided......