Thermal Interface Materials for Extreme Conditions
The most common metal thermal interface materials are made from indium alloys which melt between 100C to 200C. Some power devices I have come across d...
Indium Corporation
B2B Marcom Expertise
Indium Corporation’s Dr. Ronald Lasky is a highly-educated, very experienced electronics assembly process & materials expert. We are lucky t...
Why Solder To Steel When You Can Solder To Copper?
Okay, this has no use for semiconductor packaging that I know of, but it is a neat trick that I discovered in the lab a couple days ago. ......
Package-on-Package Process; an interview with Jim Hisert
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
RoHS Cost Pegged at $32 Billion
Folks, Circuitnet recently had a posting stating that RoHS has cost industry, and hence we the consumer $32 billion. I’d say that’s about ...
Head-in-Pillow Defects 4: Material Issues
Head-in-pillow defects related to solder paste or flux performance are classified as Materials Issues. These include poor transfer efficiency on stand...
The Speed of Simplicity
With only 24 hours to answer a customer regarding a strange flux / alloy / surface finish / temperature compatibility, we had no time to have an exoti...
Corrosion - Part 4, Learn More
Here is a pretty good list of resources on the topic of corrosion, if you’re interested: 1. Chongchen Xu. “Corrosion in Microelectronics&l...
Corrosion - Part 3, Sources and Prevention
Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such a...
Going Green By Recycling
As many other companies are “going green” so can you with the right thermal interface material. Are you using indium materials now and col...