Follow the Recipe
Soldering is quite a bit like cooking a gourmet dinner: there are raw materials, a process for putting them together, a heating temperature and time, ...
Indium Corporation
Why Invest in a Great Thermal Interface Material?
There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was t...
Georgia Tech, SRC Research in Solderless Connections May Be Crucial to Future High Performance ICs
David writes, Dear Dr. Ron, I thought you would find the article below of interest. Is appears that now there is more than just Occam to worry about. ...
Beware Condensation on Substrate Bumping Paste
Anytime something cold is introduced into a warm/humid environment it will collect droplets of water from the surrounding air. Since substrate bumping...
After the Device Packaging Conference
Now the question that remains is, was the conference worth it? I believe it was. Customers concerns and possible solutions were realized. Industry con...
Day 3 of the Device Packaging Conference
The third day of the Device Packaging Conference has passed, with some interesting presentations from NXP, Amcor, and Atotech – to name a few. M...
Green Issues Continue in Popular Media, Halogen Free Interest Grows
Folks, In my blog posting of December 1, 2005, I asked PC Magazine’s “Cranky Geek” John Dvorak about his knowledge of RoHS. H...
Tiger Woods will Not Win Grand Slam or All Tournaments He Plays This Year
Folks, I wanted to post this before today’s CA World Golf Championship and I promise to get back to more technical topics. But part of this post...