Intel Achieves Lead-Free Flip Chip Connections in 45 nm Technology
Folks, Intel announced that they now produce lead-free flip chip solder joints in their 45 nm technology. You will recall that flip chip solder joints...
Indium Corporation
Care Must be Taken in RoHS 5.5 Assembly
Folks, Some have said that I am a fan of lead-free assembly. It’s not true. In a world drowning in electronic waste, I am a fan of re-cycling......
由一条小消息想到的：Sharp Develops Technique To Recover Indium From
前几天读到这样一条短讯： Sharp Develops Technique To Recover Indium From......
Discover magazine has error that is "Not Even Wrong"
Folks, When I started this blog, my intent was that it be “friendly.” However, being a person who is concerned with math literacy, ...
Metal Thermal Interface Materials, types.
Over the past few months I have received many inquiries from engineers who are just beginning to consider metal alloys as thermal interface materials....
MOTION GRAPHICS
Video, video, video!!! We’re hearing this word several times per day lately. Who can deny that compelling video really tells a story (just ask a...
Exhibition ROI
Indium just participated (taught, learned, exhibited, networked, etc.) at SMTAi. The industry seems to be overrun with exhibitions, and the exhibitors...
Dr. Ron's Venture Outsource Article on Occam Raises Interest
Folks, Mark Zetter, asked me to write an article about Occam for Venture Outsource. The article Mark tells me has been one of their most popular recen...
Friends and Dr. Ron Present Six Sigma Cleaning Paper at SMTAI Wed, Oct 10, 10AM
Folks, I wrote a paper with Mike Bixenman, of Kyzen and Tom Gervascio of Sypris Electronics on using Six Sigma techniques to optimize cleaning in Clas...