Pressure During the NanoBond® Process
During a NanoBond® reaction, assembly pressure may determine if you create a quality solder joint. There are many details that can influence how ...
NanoFoil®
Cross Sectioning a NanoBond®
One of my favorite methods of examining a solder bond is cross sectioning. This may not give you a view over the entire area of the bondline, or give ...
First Visible Light LED Turns 50!
It is hard to believe, but 50 years ago, on October 9th, the first visible light LED was demonstrated by Nick Holonyak, Jr. of GE Advanced......
Preparing Surfaces for a NanoBond®
The first time I was taught how to solder (as a child), I was told: “All the surfaces need to be mechanically cleaned and chemically cleaned.&rd...
Design Considerations for the NanoBond® Process
The first step of the NanoBond® process should usually happen long before the NanoFoil® arrives at your facility. DFM (design for manufacturin...
Adding Solder to a NanoBond® Assembly
One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin)...
Ultrasonic Testing a NanoBond® Solder Bond
Ultrasonic Testing (UT), performed by acoustic microscopy, is a great way to determine the quality of a solder bond without destroying the assembly. ...
The NanoBond® Process
To successfully use NanoFoil®, you do not need to fully understand what it is or how it is made, although that does help. It also makes for a...
Options for Attaching Power Amplifiers: Soldering & Thermal Management
Power amplifiers and transistors come in many shapes and sizes. The performance requirements vary as well. Attaching them can be a critical aspect of ...
Plating of Indium using an Indium Sulfamate Plating Bath
The following videos show a live demonstration of the set-up and operation of the indium sulfamate plating bath. The workpiece in this demonstration i...