Posted On: January 30th, 2024 | By: Dongkai Shangguan

Interconnect Reliability: From the Chip to the System

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip ...

Posted On: August 31st, 2022 | By: Evan Griffith

Trade Show Travels June 2022

Where has the semiconductor team been traveling to this summer?...

Posted On: August 21st, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Preview: Stencil Technology

Stencil technology has evolved throughout the years, and System-in-Package solder pastes require specific stencil manufacturing processes and novel te...

Posted On: August 20th, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Preview: Solder Paste Inspection

Just as important in the solder paste printing process is solder paste inspection; how do you know if your printer is operating optimally if your SPI ...

Posted On: August 19th, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Preview: Water Soluble vs. No-Clean Pastes

Choosing the correct solder paste formulation is critical for System-in-Package assembly. Indium Corporation's SiPaste® solder pastes offer a ...

Posted On: July 19th, 2021 | By: Evan Griffith

Common Ball Grid Array Failures and How to Avoid Them

The BGA ball-mount process may seem uninteresting and trivial at first glance. However, the soldering steps are complex and can lead to problematic fa...

Posted On: January 13th, 2021 | By: Evan Griffith

WS-446HF Wetting: No Substrate Is Too Tough

There are many different substrates that are used in the electronics industry, and some are more challenging to solder than others. Indium Corporation...

Posted On: January 12th, 2021 | By: Evan Griffith

How Does the Rheology of WS-446HF Enable One-Step Cleaning?

The rheology of a flux is very important with respect to the applications of a flux. WS-446HF has a stable rheology which makes it a good choice for b...

Posted On: October 21st, 2019 | By: Indium Corporation®

Semiconductor Fluxes: Part 3

Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpa...

Posted On: October 17th, 2019 | By: Indium Corporation®

Semiconductor Fluxes: Part 2

This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes....

Posted On: October 15th, 2019 | By: Indium Corporation®

Semiconductor Fluxes: Part 1

If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products....