Moving from Silver Epoxy to Solder in Power Semiconductor Packaging
At the time of writing, the price of silver (Ag) was approaching the USD$50/tr.oz. (Troy ounce) level, and threatening to go higher. With 1 Troy ounce...
At the time of writing, the price of silver (Ag) was approaching the USD$50/tr.oz. (Troy ounce) level, and threatening to go higher. With 1 Troy ounce...
I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring as...
Once again, here are some things I learned at this year’s IWLPC show 2010 in Santa Clara. Picture below taken at Philadelphia airport,...
My friend and colleague, Eric Bastow, got back last month from an IPC standards meeting with some interesting news for those of us who supply and use ...
Solderspheres or solder spheres, or even solder balls: whatever you call them, Indium Corporation has been making them for years and has rightly acqui...
Those of you have been watching this blog for a while will know that I’ve been keeping tabs on the status of the European ELV (End-of-life vehic...
I caught up with Alan Rae after a recent IWLPC committee meeting, where he jokingly asked me to, “Stop asking important questions” –...
At some point we have all had experiences which convinced us that metals have a high thermal conductivity. It may have been the hot spoon you lef...
I have been asked on numerous occasions to calculate the potential for galvanic corrosion between metals. Most times, when I am approached with t...
Two big names in electronics assembly (Vern Solberg and Phil Damberg) recently wrote an article for Circuits Assembly Magazine regarding &ld...
Register at GlobalSpec to see Andy Mackie, Jim Hisert and me discuss various aspects of Green Electronics Manufacturing. This live ev...