Pin Transfer Basics
This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way......
Semiconductor Packaging
Determine Solidus and Liquidus Temperatures of Solder Thermal Interface Materials
As previously posted, Indiums Table of Specialty Alloys and Solders contains hundreds of solder alloys used as thermal interface materials and for eac...
Attention Thermal Testers
Metal Phase Change Materails Dispensed to mold a thermal interface gap, determining physical characteristics needed for a Thermal Interface Material ....
“Think Outside the Blog”
Dear Readers, This is the Blogs 100th entry, so I thought IҒd let you all know a little about what goes through my mind when I write an e...
Semiconductor Packages Sealed With Gold Alloy Solder to Maximize Thermal Performance
StratEdge semiconductor package optimizes thermal performance using gold-based solder seal. I......
Why Solder To Steel When You Can Solder To Copper?
Okay, this has no use for semiconductor packaging that I know of, but it is a neat trick that I discovered in the lab a couple days ago. ......
Package-on-Package Process; an interview with Jim Hisert
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...