Folks,
SMT assembly is an optimization process. There is no single stencil printing process for all PWB designs. The stencil printing parameters of stencil design, squeegee speed, snap off speed, stencil wipe frequency, and solder paste for assembling all PWBs will not be the same; just as there is no single reflow oven profile for all PWBs. Fortunately, most solder paste specifications give good boundaries for all of these parameters, but typically some trial and error experiments will be needed when assembling a new PWB design that is not similar to past assemblies.
The need for optimization is most obvious when trying to minimize defects. As an example, minimizing graping is often facilitated by using a ramp to peak reflow profile. However, the ramp to peak profile may acerbate voiding. See Figure 1.
Figure 1. The ramp to peak reflow profile may minimize graping, but acerbate voiding.
Thankfully your SMT soldering materials and equipment suppliers deal with these optimization issues on a daily basis. So if you are ever stuck with some challenging SMT assembly process, contact these solder materials and equipment experts first.
Cheers,
Dr. Ron