IGBT Assembly - Indium8.9LDA Solder Paste
The Insulated Gate Bipolar Transistor (IGBT) module is rapidly taking over from MOSFET technology as the solid-state power switch of choice. Die-attac...
What flux do you use for indium?
Don’t’ expect a simple answer – that depends on your application. span......
Predictions for 2009: Advanced Packaging
The folks at Advanced Packaging magazine asked Indium Corporation for its predictions for the Standard Semiconductor and Power Semiconductor packaging...
Solderability Testing of Die-Attach Solder Paste
Diagram of Solder-Dipping Test Apparatus Solder-wetting Curve ......
Advanced Solder Paste is Key to Improving QFN Reliability
Paste deposits printed for a QFN footprint In an article from Circuits Assembly......
Examine the Oxygen Bomb Test Report Carefully!
Indium Corporation is a big proponant of using the EN14582 oxygen bomb test method for halogen determination. However, we have seen misleading r...
Miniaturization Creates Single Solder Grain Concern
Folks, The advent of 0201 and even 01005 passives and CSPs with 30 mil lead spacings necessitate very small solder deposits in the stencil printing pr...
Welcome to the Power Semiconductor Assembly Blog
Welcome to the Power Semiconductor Assembly Blog, Indium Corporation’s information watercooler for the Power Semiconductor assembly industry. So...
Ed Briggs Weighs in on "Graping"
Folks, Recently I caught up with Ed Briggs, a member of Indium Corporation’s technical staff. I asked Ed if he would share with us his tho...
Buying a Mitsubishi Evo X
Have you ever had a hard time getting help with something? For the last year I’ve been searching......
Solder Paste Shear Thinning: A Not Well Known Concern
Viscosity Versus Number of Prints Folks, Solder pastes are a very complex “fluid” of high viscosity. Their behavior, when experiencin...