Miniaturization Creates Single Solder Grain Concern
Folks, The advent of 0201 and even 01005 passives and CSPs with 30 mil lead spacings necessitate very small solder deposits in the stencil printing pr...
Folks, The advent of 0201 and even 01005 passives and CSPs with 30 mil lead spacings necessitate very small solder deposits in the stencil printing pr...
Rick Short shaving my head for charity So why Blog? Whatever I choose to call this thing that you are currently reading, it’s a Blog. But what.....
A small selection of our Pb-free solder alloys In possibly one of the quietest revolutions in the history of Power Semiconductor electronics manufactu...
For our second guest blogger i would like to introduce Dr. Harald Wack, President of Zestron. Zestron is manufacturer of flux residue cleaners a...
Id feel bad cutting into this cake. Would that be cross-sectioning? span style="font-size:......
Welcome to the Power Semiconductor Assembly Blog, Indium Corporation’s information watercooler for the Power Semiconductor assembly industry. So...
Folks, Recently I caught up with Ed Briggs, a member of Indium Corporation’s technical staff. I asked Ed if he would share with us his tho...
Have you ever had a hard time getting help with something? For the last year I’ve been searching......
Viscosity Versus Number of Prints Folks, Solder pastes are a very complex “fluid” of high viscosity. Their behavior, when experiencin...
For a change of pace, again, I have asked another Technical Support Engineer, Chris Nash, to comment about powder sizes. Chris is the Regional T...
Seth Homer is a Product Support Specialist for Engineered Solder Materials. He’s like a Green Beret or Navy Seal of solder preforms...