Properties and Uses of Low-Temperature Solder Alloys – (Part 3)
Expansion during cooling is a property of low-temperature alloys that can be very useful....
CTE
Reversing the Effects of CTE Mismatch
Coefficient of Thermal Expansion (CTE) differences between materials can really cause problems when those materials are rigidly bonded. If you’v...
Bonded Sputtering Targets are a Bi-Metallic Assembly
Whenever two materials with different coefficient of thermal expansion values are bonded together, they will expand and contract as the temperature ch...
2013 SVC Presentation: Eliminating the Bond Stress of Sputtering Targets at Operational Temperatures
I invite you to come to the Emerging Technology session of the SVC (Society of Vacuum Coaters) Conference on Wednesday April 24th – where I&rsqu...