Indium Solder for Heat Sensitive Components
Indium alloys can help you by reducing the assembly temperature needed to form interconnections. (solder joints)...
Indium alloys can help you by reducing the assembly temperature needed to form interconnections. (solder joints)...
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow, discuss approaches for reaching near zero voiding and how v...
Eric Bastow, Assistant Technical Manager, America’s Region, shares results of tests he’s conducted on the effect of reflow environments on...
Vacuum Reflow can help reduce voiding in SMT assembly but the process varies from conventional convection reflow. Here's how to achieve the&...
Soldering without flux is generally regarded as difficult if not impossible. Yet a fluxless process is routinely done with 80Au/Sn ribbon and preforms...
Trying to select and develop the proper reflow profile? This video explores the differences between the three main profile types. ...
This video is for anyone interested in the role of solder paste particle size with regard to reflow and printing. Keywords: Phil Zarrow, Ed Briggs, eb...
This video is for people who are trying to select or develop the proper reflow profile. It will tell you the differences between the three main profil...
Interested in the effect your reflow profile can have on solder preforms? Check out my guest post on Jim Hisert’s blog! Applying Sold...
It sounds bad for me to say this, but I have a lot of SMT magazines cross my desk and, honestly, the solder paste articles rarely draw my interest. I ...
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, espe...