Achieving 8% Voiding When Soldering Bottom-Terminated Components (VIDEO)
A paper presented at SMTAI 2016 on reducing voids in bottom-terminated components......
SMT
SMT Processes Certification
Indium Corporation's Marketing Communications Specialist Colleen Bierstine discusses SMT Processes Certification with the creators of the SMT Proc...
Handbook of Electronic Assembly Now Available
Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Strom...
SMT Optimization for Success Part 3: Flux Chemistry
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the t...
Demonstrating Zero Defects In SMT Production?
Folks, let’s see how Patty is doing at Ivy U….. Patty had to admit that she really liked being a professor at Ivy University. No, t...
Handbook of Electronic Assembly Now Available
Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Strom...
What a J-STD-004 classification of "OR" means and what it doesn't mean
Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recogn...
Conozca el bloguero más nuevo de Indium Corporation
Hola mi nombre es Iván Castellanos y me es muy grato presentarme ante ustedes por parte de Indium Corporation blog en español. Este blog...
Important Classes for Understanding Solder
Solder seems pretty simple, and, honestly, it doesn’t always need to be overly technical. But, many SMT, semiconductor, thermal management, and ...
Get SMT Process Engineer Certified @ SMTAI!
Folks, This year will mark the 10th anniversary of SMTA’s SMT Process Certification Course. This course was developed by Jim Hall, Phil Za...
Lead-Free Electronics Assembly Using the SMT Process - at PCM
Folks, Struggling to find a good, royalty-free, video of electronics assembly, my Dartmouth ENGM 185 class on manufacturing processes decided t...
锡膏和底部填充剂的兼容性 (Solder Paste Compatiblity with Underfill in SMT)
在SMT中，底部填充剂(underfill) 常常被用在BGA/QPN 的组装...
Silver-free and Low-Silver Solder Alloys for SMT Discussion, Part 1: Reliability
There seems to be a growing trend to use a low-Ag or Ag-free solder alloy for Surface Mount Technology (SMT) electronics assembly, similar to what is ...
A Great Marcom Success Story
I am proud of a recent Marcom development executed by the Indium team. I want to use this space to thank each and everyone involved for their contribu...
Innumeracy and Electronic Assembly
Friends, I teach numerous workshops and certification courses. I often find significant “math” resistance at these workshops, even when I ...
Cost Estimating Non Automated Processes
Hello Dr. Lasky, Could you send me a pdf or word.doc file with more details about your techniques on cost estimating for SMT assembly. I would like to...
Six Sigma at Dartmouth
Folks, One of my adventures at Dartmouth is the establishment a “Six Sigma” program. This effort is in conjunction with SMT magazine (Penn...