WS-446HF Wetting: No Substrate Is Too Tough

There are many different substrates that are used in the electronics industry, and some are more challenging to solder than others. Indium Corporation...

Posted On: August 6th, 2014 | By: Eric Bastow

Indium Plating of Fine Features onto Masked Surfaces and Other Substrates

There is a lot of interest in plating indium bumps and other fine features onto wafers and other substrates. And the desired bump size and pitch ...