Process Considerations for QFN Voiding in SMT Electronics Assembly (1/3)
This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of Avoid the Void®......
This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of Avoid the Void®......
We have observed that the temperature at which two materials are bonded will set the base temperature that any subsequent CTE is measured from. T...