Driving the Packaging Frontier: Part 1
Indium Corporation’s Dr. Andy Mackie, Senior Product Manager, Semiconductor and Advanced Assembly Materials, and Sze Pei Lim, Regional Manager, ...
Videos
Innovations for the Factory Floor: the Creation of EZ-Pour®
Learn how EZ-Pour® has changed and simplified the process for using gallium trichloride from a multi-step process to a simple glove box envir...
LEDs Everywhere: How Indium Factors into LED Manufacturing
Bill Jackson and Phil Zarrow discuss how the element indium factors into LED manufacturing....
Avoid the Void®: Voiding in High-Temperature Soldering
Gold-tin eutectic solder can be used as the second-step solder, after the initial die-attach step. ...
Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms
Voiding is a major problem in electronics assembly, especially in high-temp applications ...
SiP Materials (System-in-Package) VIDEO
There exists a wide range of assembly products for the SiP process, especially solder pastes....
Ball-Attach Flux: WS-575-C-RT (VIDEO)
Currently, for the ball-attach process, customers are facing issues like warpage of the substrates......
Avoid the Void® Common Causes of Voiding in Electronics Assembly
This video is for anyone interested in the causes and effects of voiding in solder paste. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, voidin...
Introduction to Head-in-Pillow and Non-Wet Open Defects In Electronics Assembly
This video is for anyone interested in mitigating head-in-pillow and non-wet open defects. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, head-...
In-Circuit Testing with Fast-Break Residue No-Clean Solder Paste
This video is for those interested in In-Circuit Test (ICT) with no-clean solder paste. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, In-Circu...
Printing Differences Between No-Clean and Water-Soluble Solder Pastes
The printing differences between no-clean and water-soluble solder paste. Keywords: Phil Zarrow, Ed Briggs, ebriggs@indium.com, printing, water-solubl...
Electronics Assembly: An Introduction to Particle Size and Printing Smaller Area Ratios
This video is for anyone interested in the role of solder paste particle size with regard to reflow and printing. Keywords: Phil Zarrow, Ed Briggs, eb...
Flux-Cored Wire in Robotic Soldering
Looking for a way to Avoid the Void® using high-quality cored wire? Click here....
Flux Challenges Regarding Flip-Chip/BGA Balling
This video is for anyone interested in the flux challenges associated with flip-chip/BGA balling. Keywords: Phil Zarrow, Andy Mackie, Indium Corporati...
One-Step Soldering in Flip-Chip Assembly
This video is for anyone interested in flip-chip/BGA balling using the one-step assembly process. Keywords: Phil Zarrow, Andy Mackie, amackie@indium.c...
Flip-Chip/BGA Balling: Halogen-Free/Halide-Free
This video discusses the halogen-free issues of BGA/flip-chip balling. Keywords: Phil Zarrow, Andy Mackie, flip-chip, BGA, balling, halogen......
Voiding in Flux-Cored Wire
Voiding in flux-cored wire causes serious problems. Learn about the causes of voiding and a way to Avoid The Void®...