Specifying Solder Preforms – Packaging
Packaging is an extremely important part of specifying solder preforms. Not only does packaging affect the price of the order, it also effects how the...
Packaging is an extremely important part of specifying solder preforms. Not only does packaging affect the price of the order, it also effects how the...
Folks, As mentioned in the last post, it is a common problem with the PIP (pin-in-paste) process to struggle to get adequate solder volume. If ...
While in South East Asia last summer, Indium’s technical team and I had a chance to discuss flip-chip dipping processes with a major equipment v...
NanoFoil® is especially well-suited for bonding LED packages. Here are some characteristics of the NanoBond® Process that fit high v...
NanoFoil® can be packaged in tape & reel, bulk containers, or waffle packages. Here are the main advantages of each type of packaging: Tape &a...
Did you ever hear the expression, “think like a 12-year-old”? Meaning a 12-year-old has enough learning to address a problem but not...
Solderspheres or solder spheres, or even solder balls: whatever you call them, Indium Corporation has been making them for years and has rightly acqui...
Shelf life means different things in different situations. Post something on the internet and it will last forever. Leave fresh fruit out ...
There is nothing more frustrating than going through an entire process (whether it is putting together a puzzle or manufacturing a product) only to fi...
Considering a fusible alloy as a solution really starts with the applications temperature profile. When cooking a turkey (pop-up timer) ...
Tape and Reel Tape and Reel has been on my mind a lot lately. Staying on top of this preform packaging trend is important. Whether we’re looking...
Seth Homer is a Product Support Specialist for Engineered Solder Materials. He’s like a Green Beret or Navy Seal of solder preforms...