In a collaboration between Indium, Dek, and FRT, a team was formed to evaluate flux printing for wafer level packaging. The results of the testing last week will be presented at the International Wafer Level Packaging Conference (IWLPC) in October. The testing focused on evaluating 7 different fluxes printed onto wafers for wafer level sphere attachment. The FRT metrology equipment was used to measure the volume of these tiny (down to 50um diameter) translucent flux deposits.