In a collaboration between Indium, Dek, and FRT, a team was formed to evaluate flux printing for wafer level packaging. The results of the testing last week will be presented at the International Wafer Level Packaging Conference (IWLPC) in October. The testing focused on evaluating 7 different fluxes printed onto wafers for wafer level sphere attachment. The FRT metrology equipment was used to measure the volume of these tiny (down to 50um diameter) translucent flux deposits.
The Wafer Printing Dream Team
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
