Minimizing Tombstoning
Folks, This post is an excerpt from Indium Corporation's The Printed Circuits Assemblers Guide to Solder Defects. Introduction: Printed...
Folks, This post is an excerpt from Indium Corporation's The Printed Circuits Assemblers Guide to Solder Defects. Introduction: Printed...
This video is for people who are trying to select or develop the proper reflow profile. It will tell you the differences between the three main profil...
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “...
Folks, Some years ago, a leading IC manufacturer decided that their R&D effort could benefit if analyzed for possible improvement – by hirin...
Folks, I’m taking a few moments from Wassail Weekend , held annually in my village, Woodstock VT, “The prettiest small town in Americ...
Tombstoning (also known as the Manhattan effect, drawbridge effect, or Stonehenge effect) is described (in the simplest, and most common, sense) as oc...
Many, many thanks to the hundreds of you who came by the Indium Corporation booth at Semicon West this year. Some of you came to hear about ...
Included in a solder paste‘s Product Data Sheet, among other things, are general guidelines which aid the customer in designing a...
There seems to be a growing trend to use a low-Ag or Ag-free solder alloy for Surface Mount Technology (SMT) electronics assembly, similar to what is ...
Folks, I thought I would take a stab at listing the minuses, pluses, and “it’s a wash” aspects of assembling with lead-free (LF) sol...
Tombstoning, simply, is the wetting of one side of a component before the other side, which causes the setting forces of the solder to lift the compon...
Folks, Answers to the quiz of a few weeks back…... Phil and Rob had agreed to ask the GM if it was OK to ask the tech and engineers at some of...