Newsroom

Newsroom Archives - 2024

Welcome to Indium Corporation's newsroom archives. Here you will find Indium Corporation's global communications activities, as well as our media interviews.
Werner H. J. Wagner Appointed as General Manager of Indium Corporation Advanced Materials GmbH news photo
Werner H. J. Wagner Appointed as General Manager of Indium Corporation Advanced Materials GmbH
June 11, 2024
Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J. Wagner as its new General Manager. With a career spanning over three decades in business management and sales leadership, Wagner brings not just a wealth of experience, but also a proven track record of transformative leadership that is set to drive positive change at Indium Corporation Advanced Materials GmbH.
Indium Corporation Experts to Present on High-Temp, Lead-Free Solder Paste & High Reliability Liquid Metal Alloys Poster at ECTC news photo
Indium Corporation Experts to Present on High-Temp, Lead-Free Solder Paste & High Reliability Liquid Metal Alloys Poster at ECTC
May 16, 2024
Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado. The presentation, part of the Advanced Die Bond and Board Level Reliability session, will examine the findings from technical paper, The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications.
Indium Corporation’s Sze Pei Lim to Present on Semiconductor Packaging at ICEP Japan news photo
Indium Corporation’s Sze Pei Lim to Present on Semiconductor Packaging at ICEP Japan
April 2, 2024
Indium Corporation's Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP 2024). The presentation will take place on April 18 in Toyama, Japan, as part of the iNEMI session. During the presentation, Lim will discuss the results of a technical paper titled Low-Temperature Material Discovery and Readiness for First-Level Interconnect in Semiconductor Packaging. The full conference is being held April 17-20. 
Indium Corporation Celebrates 90 Years of Materials Science Innovation news photo
Indium Corporation Celebrates 90 Years of Materials Science Innovation
March 13, 2024
Indium Corporation, a global leader in materials science and electronics assembly solutions, will commemorate its 90thanniversary on March 13. Indium Corporation's innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies such as electric vehicles, mobile devices, life-saving medical devices, and emerging 5G technology to name just a few. 
Indium Corporation to Feature Durafuse® Solder Technology, EV Products at APEX 2024 news photo
Indium Corporation to Feature Durafuse® Solder Technology, EV Products at APEX 2024
March 4, 2024
With more than five million electric vehicles (EVs) on the road with its materials and nearly a decade of experience in the market, Indium Corporation® is proud to feature its innovative Durafuse® solder technology alongside its Rel-ion™ portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, April 9-11, in Anaheim, California, U.S.
Indium Corporation to Feature New Semiconductor Products for HIA and SiP at IMAPS Device Packaging Conference news photo
Indium Corporation to Feature New Semiconductor Products for HIA and SiP at IMAPS Device Packaging Conference
February 29, 2024
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation®will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 18‒21, in Fountain Hills, AZ. 
Indium Corporation Technical Expert to Present at India Electronics Week news photo
Indium Corporation Technical Expert to Present at India Electronics Week
January 17, 2024
Indium Corporation's Principal Engineer – Advanced Materials, Andy C. Mackie, Ph.D., MSc,  is scheduled to deliver an insightful presentation on advanced packaging and heterogeneous integration as part of India Electronics Week. As part of one of the largest conferences on electronics in Asia, the presentation is scheduled for 12:00 p.m. local time on February 2 at KTPO Whitefield in Bengaluru, India.  
Indium Corporation to Feature High-Reliability Materials for Power Electronics at NEPCON Japan news photo
Indium Corporation to Feature High-Reliability Materials for Power Electronics at NEPCON Japan
January 16, 2024
Indium Corporation® is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.