Indium Corporation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California.

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.

Indium Corporation Senior Technologist Dr. Ronald Lasky and Senior Product Development Specialist Kevin Brennan will deliver a series of presentations at the Pan Pacific Strategic Electronics Symposium (Pan Pac 2025), taking place January 27-30 in Maui, Hawaii.

Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MD&M West, taking place February 4-6 in Anaheim, California.