Products: Inorganic Compounds

Indium Tin Oxide: For Flat-Panel, Touch-Screen Technologies

EZ-Pour® Gallium Trichloride, Part 1

EZ-Pour® Gallium Trichloride, Part 2

Indium Acetate: Vivid Quantum Dots

Indium Corporation’s Innovations For the Factory Floor Part 1: EZ-Pour®

Indium-Tin Oxide (ITO) Used in Flat-Panel Displays

Liquid Metals Wet Glass @ Room Temperature: Indium Corporation

Indium Corporation’s Innovations For the Factory Floor Part 2: Indium Tri-Chloride Type H
Products: Metals

Indium Corporation: Melting Gallium with Body Heat

Gallium Metal – Gallium is Great!

6 Alloy Families: Bismuth

6 Alloy Families: Gallium

6 Alloy Families: Gold

6 Alloy Families: Indium I

6 Alloy Families: Indium II

6 Alloy Families: Lead

6 Alloy Families: Tin

Indium is Abundant!

Indium Metal – Reclaiming This Versatile Metal

Indium Used for Pigment

The Hard Facts on Soft Metal
Products: Solders

Rel-ion™ Driving e-Mobility: Uptime

Rel-ion™ Driving e-Mobility: Industry Development

Rel-ion™ Driving e-Mobility: Automotive Trends

Rel-ion™ Driving e-Mobility: EV Advancement

Rel-ion™ Technology: Proven Products for e-Mobility

Rel-ion™ Driving e-Mobility: Equal Opportunity Industry

12.8HF for Jetting and Microdispensing

Rel-ion™ Driving e-Mobility: Standards

Rel-ion™ Driving e-Mobility: Energy Storage

Rel-ion™ Driving e-Mobility: Collaboration

Rel-ion™ Driving e-Mobility: Indium Corporation’s Proven Products

InTACK™ Technology: The Solution for Power Module Assembly Tooling

InFORMS® for Power Module Reliability

Rel-ion™: The Future of EV is Here

Driving e-Mobility: Rel-ion™ Technical Webinars

AuLTRA™ ThInFORMS™ for Die-Attach Applications

Achieve Better Dispensability with Indium12.8HF Jetting/Microdispensing

Indium12.8HF Jetting and MicroDispense Paste’s Features

Indium12.8HF Solder Paste for Jetting and Microdispensing

Voiding in Flux-Cored Wire

Durafuse® LT: The Ultimate Drop Shock Solution

Rel-ion™: Proven Solders for Electric Vehicle Manufacturing

Off-Eutectic Gold Tin Preforms

Indium12.8HF Solder Paste Trusted by Jetting and Microdispensing Equipment Leaders

Innovative Low-Temperature Alloy Innovation

Indium8.9HF ‐ The Proven Automotive Solder Paste

Water Soluble vs. No Clean Technology

Indium Corporation’s Low-Spatter, Flux-Cored Robotic Soldering Wire

Avoid the Void® Using Heat-Spring Metal Thermal Interface

Avoid the Void® with halogen-free Indium 8.9HF Solder Paste

Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms

Avoid the Void®: Indium8.9HF Solder Paste with Andreas Karch

Avoid the Void®: Voiding in Gold-Tin (AuSn20) Solder Joints

Benefits of Solder Fortification® Preforms

Calculating Confidence Intervals of Cpk in Stencil Printing

Choosing Flux-Coated Solder Preforms

Flux-Cored Wire in Robotic Soldering

Indium Corporation - Soft Solder Superstars

Indium Corporation: Flux-coated preforms - LV1000

Indium Corporation: Heat-Spring® Thermal Interface Material INTRO

Indium Corporation: Specifying solder preforms

An Introduction to Particle Size and Printing Smaller Area Ratios

Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void®

Indium3.2HF Solder Paste

Indium8.9 Pb-Free No-Clean Solder Paste

Indium8.9HF Solder Paste: Material Comparisons for Soldering Process Issues

InFORMS® A Drop-In Replacement

Live @ APEX 2015

LV1000 Flux Coating for Solder Preforms

No-Clean vs. Water Soluble Solder Paste

Reducing Voiding with LV1000 Flux-Coated Solder Preforms

Selecting the Appropriate Halogen-Free Solder Paste

Solder Fortification® Using Preform-In-Paste (PiP) - Indium Corporation

The Versatile Solder Preform
Products: Thin Film Materials
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