e-Mobility electronics technology is advancing at a very high rate, driven by three main factors:

• Increased safety: the ubiquity of advanced driver assistance systems (ADAS)
• Electrification: The move from the internal combustion engine (ICE) to increasingly electrified and fully electric vehicles.
• Automation: The nature of vehicle ownership is also driving a need for semi- and fully-automated driving vehicles (S/F-ADV), separate from safety issues

Significant challenges in e-Mobility electronics remain, the intent of this webinar is to address the following concerns:

• Market and technical forces impacting the global market
• Energy infrastructure and its impact on vehicles
• Vehicle charging
• Datacenter AI to support ADV
• The automotive electronics supply chain and the evolution of the traditional Tier 1
• Types of passenger vehicles and the nature of electronics in those vehicles
• The changing nature of automotive electronics reliability in light of:
• New approaches to reliability
• Increased power and power density
• Increased functional density
• How Indium Corporation is working with customers and equipment partners to meet customer needs.

The third and last part of the Defeating Defects in Electronics Assembly (SMT Process) webinar series will cover tombstoning, solder balling and beading, and wave soldering defects such as bridging, shadowing, skipping, blow-holes, and icicles.

LED devices are becoming more complex and the soldering assembly of these materials is getting more complex as well. If you imagine the larger infotainment screens in modern cars, large video walls at malls and sports stadiums, and even modern TVs, advanced LED technology is likely responsible for these technology advancements.

In the electronics manufacturing space, and in particular in the advanced assembly space, there has been renewed interested in smaller LED technologies that support advanced display devices and other lighting technologies. This webinar will focus on two of those technologies, Mini LED, and Micro LED. This webinar will first explain the differences in application between these two technologies and how the market has necessitated the development of each. The webinar will then discuss the typical assembly process flow of building both Mini LED and Micro LED devices and the differences between those assemblies and that of standard SMT assembly. Finally, this webinar will discuss what the focus is for designing soldering material for Mini LED and Micro LED assembly and relevant material properties and test methods for ensuring high-yield devices.

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE heterogeneous integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials (sTIMs) in both CPU and GPU “die to lid/heat spreader” (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. 

Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding. 
The paper also considers the use of solder TIMs in the context of alternative TIM applications and technologies, such as thermal greases, pads, and phase change materials, as well as liquid metals. 

Reliance on complex, costly alignment fixturing is growing as power module designers seek repeatable manufacturing and to achieve high-reliability performance. Flux-free soldering techniques are being deployed widely to meet the increasing requirements for quality, low voiding and cleanliness driven by Automotive/EV use cases. The emergence of sintering materials for SiC module applications are also a key consideration as manufacturers look at opportunities to scale processes and leverage the high-performance properties. 

An emerging material technology, InTACK™, can be applied during assembly to provide robust tacking strength and reduce the dependency on customized fixturing. The absence of residue and contamination with InTACK™ make this a viable option for flux-free soldering and sintering applications where cleanliness directly influences reliability performance. Test data is analyzed to evaluate material characteristics for dispensing, tack strength, and post-processing. In addition, case studies are reviewed to demonstrate opportunities for reduced process steps, cycle time, and overall cost of ownership in power module manufacturing.

This Insider Series Webinar will cover statistical process control (SPC). SPC is an important tool in controlling SMT assembly processes, especially stencil printing. 

The webinar will start with a discussion of the 6 Ms of variation and then delineate common cause and special cause variation. The difference between precision and accuracy will then be clarified. After discussing the precision tolerance ratio, the technique to perform a Gage R&R (Repeatability and Reproducibility) analysis will be presented. Process control charts, and their development by Walter Shewhart, will then be discussed including the Shewhart Rules. Several sets of SPC Xbar-R and C Chart data will then be plotted and analyzed with Minitab®. A 30 day trial version of Minitab is available for free.

The webinar will conclude with a discussion and application of the process capability indices C_p and C_px. 

SPC 101 Topics Covered:

• The 6 Ms of variation
• Special Cause and Common Variation
• Measuring as a Process
• Precision and Accuracy
• Precision/Tolerance Ratio
• Gage R&R (Repeatability & Reproducibility) Analysis
• Control Charts- Shewhart Rules
• Xbar R Charts
  • Stencil Printing Example
• C Charts
• Pareto Charts
• Cp and Cpk with Examples
• Minitab will be used throughout

Flip-Chip bonding technology has a long history, stemming from its inception by General Electric in (curiously) Indium Corporation’s hometown of Utica, New York. As such, the term “flip-chip” has evolved to encompass a wide variety of bonding technologies which solve various bonding challenges. However, in the most basic sense of the term, flip-chip bonding defines the bonding process in which the circuitry of a chip is manufactured face-down and flipped to be attached to a substrate.

In this webinar, the history of flip-chip technology, and the trends which have caused the manufacturing process to evolve will be discussed. Common failure modes in flip-chip assembly will also be touched on, as well as how material advancements have allowed for and will continue to push new technology in flip-chip bonding.

A short time ago we covered DOE 101, the basics of Design of Experiments in an Insider Series Webinar You can watch this webinar here. DOE 201 is a follow on Insider Series Webinar on advanced DOE techniques, mostly what are called screening and reduced designs. Screening designs are performed when there are so many factors to analyze that performing a DOE with all of the factors at a high number of factor levels is not practical. As an example, suppose there is a DOE with 6 factors, each at 4 levels. This DOE would require at least 4⁶ = 4096 runs. 

In cases like this one, screening experiments are often performed to determine which factors are important. In a screening experiment, each factor is only evaluated at two levels. So in this case the number of data points, or runs, required is only 2⁶ = 64. In some cases, it is possible to reduce the number of runs further by employing a fractional factorial design.

This webinar will discuss how to perform these screening and fractional factorial DOEs and the risks in doing so. In the webinar, several screening and fractional factorial DOEs will be analyzed with Minitab. The data will be given to the attendees so that they can practice on their own. A 30 day trial version of Minitab is available for free. 

This webinar will review some of the topics that are covered in SMTA Certification. It will be presented by Professor Ron Lasky, Ph.D., PE, a co-founder of the SMTA Certification Program. The webinar will start with a review of 10 short-answer questions that certification candidates are expected to know coming into the exam preparation course. A review of the exam preparation course will then be given. The webinar will then review three potential calculation problems that might be on the exam:

1. How to design a stencil.
2. How to match a reflow profile to a solder paste spec.
3. How to determine the belt speed on a reflow oven for the required throughput.

At the end, the attendees will have a sense of what the exam preparation course and the exam itself are like.

Tin whiskers continue to be a major concern in electronics assembly. This workshop will start with an explanation of tin whiskers and their formation. Then, it will summarize their potential risks and mitigation techniques. A description of Failure Modes and Effects Analysis (FMEA) as a technique to assess tin whisker risk, for a given technology, will then be discussed.

Presenter Dr. Ron Lasky will conclude this workshop with a discussion of tin whisker reliability strategies for consumer and mission critical products. At the end of the presentation, attendees will have all of the basic relevant information to develop an effective tin whisker strategy.

The formation of copper-tin intermetallics is fundamental to a functional solder joint. In creating most solder joints, two pieces of copper – which melt at 1085°C – are bonded together with solder, at less than 230°C. Most of us, with years of experience in electronic assembly, don’t usually think of this technological “miracle” of soldering. We are able to bond two pieces of copper together at a temperature low enough where the bonding can be performed in the presence of polymer material. Without this low-temperature formation of copper-tin intermetallics, the electronic industry might not exist. However, contemporary wisdom is that these intermetallics are brittle and can result in poor thermal cycle or drop shock performance.

In this webinar, Dr. Ron Lasky will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance. The brittle nature of copper-tin intermetallics will also be discussed. In addition, several graphs of intermetallic growth rate will be presented. Some of the additional ancillary effects of copper-tin intermetallic growth – such as tin whiskers and their mitigation – will also be discussed.

Los defectos de soldadura en SMT pueden surgir de tres áreas principales: diseño, materiales y proceso. Identificar la causa raíz y solucionar estos defectos puede resultar costoso. Pueden existir muchas formas de resolver un defecto de proceso y, a menudo, la forma más fácil y menos costosa de resolver algunos de estos defectos de soldadura es optimizando el proceso de reflujo. Pero para comprender cómo optimizar mejor el perfil de reflujo, es crucial comprender los conceptos básicos detrás de los materiales/ingredientes de la soldadura. En las dos sesiones de “Perfil de Reflujo 101,” el presentador Iván Castellanos explicará algunos de los conceptos básicos de la ciencia de los materiales detrás de las pastas de soldadura y cómo este conocimiento se puede utilizar para optimizar el perfil de reflujo para resolver algunos defectos comunes de soldadura.

Impresión 101 … así cómo la industria de SMT ha evolucionado y se ha hecho cada vez más demandante y exigente, por lo tanto, es sumamente importante entender los principios básicos de los procesos.

Uno de los pasos iniciales más importantes en los procesos de SMT, es depositar soldadura en pasta de manera correcta sobre nuestro PCB y es comúnmente realizado utilizando impresión por estencil.

Sin embargo, la mayoría de los defectos en procesos de SMT pueden tener relación con un mala impresión de soldadura en pasta. Retomando las bases del proceso y asegurando un set up adecuado puede ayudar en la prevención de defectos en tus líneas de SMT.

En dos sesiones de Impresión de soldadura en pasta 101, Ivan Castellanos hablara acerca del proceso de impresión de soldadura en pasta y diseños de experimentos (DOE) típicos que pueden ser utilizados para generar información y datos sobre cómo se comporta el proceso.

As the industry has evolved and SMT has become more demanding, it is important to understand the basics of the process. The first and the most important step in the SMT process is successfully getting the adequate amount of paste on the board, which is commonly done by stencil printing. However, the same step is also responsible for a majority of defects in the SMT process. Going back to the basics and ensuring you have the correct materials, design and setup can save you from expensive defects down the line. In Solder Paste Printing - Fundamentals and Best Practices, presenters Liyakathali Koorithodi and Tushar Tike will talk about the material, design and process aspects affecting solder paste printing and proven ways to overcome these challenges.

About our co-presenters:

Liyakathali Koorithodi Area Technical Manager

Liyakathali is the Area Technical Manager for India. He provides support for Indium Corporation’s full line of materials for electronics assembly, semiconductor and advanced assembly, and thermal management markets. He is based in Chennai, India.

Liyakathali has more than 20 years of experience in electronics assembly manufacturing. He has a diploma in mechanical engineering from the Department of Technical Education, Government of Kerala, and is an SMTA-certified SMT Process Engineer. He earned his six-sigma green belt from Motorola University.

Liyakathali previously worked for several major manufacturing companies, including two years with Nokia in Chennai. In addition, Liyakathali has written articles for several industry publications and has presented at numerous technical conferences and customer sites.

Tushar Tike Area Technical Manager

Tushar is the Area Technical Manager for North and West India. He provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders and thermal management materials. He is currently based in Mumbai, India.

Tushar joined Indium Corporation in 2019. He has previously worked as a process engineer for a global EMS provider in San Jose, Calif., where he focused on process stability and improvements in SMT and post-SMT stages for various product types.

He earned his B.Tech. in mechanical engineering from Mumbai University and an M.S. in industrial and systems engineering from the State University of New York at Binghamton. He is a Certified SMT Process Engineer (CSMTPE) and earned his Lean Six Sigma Green Belt Certification from Dartmouth College’s Thayer School of Engineering, N.H., U.S..

Impresión 101 … así cómo la industria de SMT ha evolucionado y se ha hecho cada vez más demandante y exigente, por lo tanto, es sumamente importante entender los principios básicos de los procesos.

Uno de los pasos iniciales más importantes en los procesos de SMT, es depositar soldadura en pasta de manera correcta sobre nuestro PCB y es comúnmente realizado utilizando impresión por estencil.

Sin embargo, la mayoría de los defectos en procesos de SMT pueden tener relación con un mala impresión de soldadura en pasta. Retomando las bases del proceso y asegurando un set up adecuado puede ayudar en la prevención de defectos en tus líneas de SMT.

En dos sesiones de Impresión de soldadura en pasta 101, Ivan Castellanos hablara acerca del proceso de impresión de soldadura en pasta y diseños de experimentos (DOE) típicos que pueden ser utilizados para generar información y datos sobre cómo se comporta el proceso.

Thermal interface materials (TIMs) are typically thin films of material that transfer heat from one surface to a cooler one. The thermal engineer or thermal architect is faced with many choices when assessing which TIM will best conduct heat away from sensitive devices. Pure metal or metal-based TIMs may be overlooked, even though their inherently high bulk thermal conductivities and higher performance make them worthy of consideration.

Metal TIMs have been successfully used for decades in high-end applications such as power amplifiers for military and aerospace; in single-die lidded packages for high-end server CPUs; and in consumer PC applications where even liquid metals have been used. The enormous increases in demand for reliable high-performance computing (HPC) and artificial intelligence/machine learning (AI/ML) applications, combined with both increased heat flux (W/cm²) and increased device sensitivity to temperature have led to a major semiconductor packaging focus on low thermal resistance solutions. Metal TIMs are an increasingly prominent part of that mix.

This webinar will examine the specific ways that the HPC and AI/ML market segments are driving an enormous growth in demand for high performance, and, increasingly, for metal-based TIMs, and will also explore how continuous innovation at Indium Corporation is allowing us to meet that demand.

Low-temperature soldering is not a “one alloy fits all” solution. Depending on the application, the actual temperature required for low-temperature soldering can vary widely. In Low-Temperature Solder Innovation — Durafuse™ LT and the Low- to Mid-Temperature Space, Claire Hotvedt will examine Durafuse’s ability to bring mid-temperature drop shock properties into the upper edge of the low-temperature space, as well as low-temperature solder’s specific process limitations and lifetime requirements.

As the industry has evolved and SMT has become more demanding, it is important to understand the basics of the process. One of the most important first steps in the SMT process is successfully getting the paste on the board, which is commonly done by stencil printing. However, a majority of defects in the SMT process can stem from incorrect stencil printing setup. Going back to the basics and ensuring you have the correct setup can save you from defects down the line. In two sessions of Stencil Printing 101, Presenter Meagan Sloan, CSMTPE, will talk about the solder paste printing process and typical design of experiments (DOE) that can be used to obtain data on how the solder paste will perform.

As the industry has evolved and SMT has become more demanding, it is important to understand the basics of the process. One of the most important first steps in the SMT process is successfully getting the paste on the board, which is commonly done by stencil printing. However, a majority of defects in the SMT process can stem from incorrect stencil printing setup. Going back to the basics and ensuring you have the correct setup can save you from defects down the line. In two sessions of Stencil Printing 101, Presenter Meagan Sloan, CSMTPE, will talk about the solder paste printing process and typical design of experiments (DOE) that can be used to obtain data on how the solder paste will perform.

Soldering defects in SMT can arise from three main areas: the design, the materials, and the process. Identifying the root cause and troubleshooting these defects can be timely and expensive. There can be many ways to resolve one solder issue and oftentimes the easiest and least expensive way to resolve one of these soldering defects is by adjusting the reflow process. But in order to understand how to best optimize the reflow profile, it is crucial to understand the basics behind the solder materials. In the two sessions of Reflow 101 from a Solder Manufacturer’s Perspective, Indium Corporation, will explain some of the materials science basics behind solder pastes and how this knowledge can be used to optimize the reflow profile in order to resolve some common solder defects.

Soldering defects in SMT can arise from three main areas: the design, the materials, and the process. Identifying the root cause and troubleshooting these defects can be timely and expensive. There can be many ways to resolve one solder issue and often times the easiest and least expensive way to resolve one of these soldering defects is by adjusting the reflow process. But in order to understand how to best optimize the reflow profile, it is crucial to understand the basics behind the solder materials. In the two sessions of Reflow 101 from a Solder Manufacturer’s Perspective, Indium Corporation, will explain some of the materials science basics behind solder pastes and how this knowledge can be used to optimize the reflow profile in order to resolve some common solder defects.

Miniaturization has been, and continues to be, a challenge for the electronics industry. Assemblies are getting more complex and component spacing is steadily decreasing. With more dies and components packed into smaller footprints, the need for heterogeneous integration for advanced packaging is getting greater. However, solder paste printing is not always possible in some packaging designs and solder paste dispensing can be an alternative method for solder paste deposition. Ultrafine solder paste dispensing is only achievable with the correct combination of dispensing equipment and solder materials. In Ultrafine Solder Paste Dispensing for Heterogeneous Integration, presenter Kenneth Thum will discuss different dispensing equipment technologies and important solder paste characteristics, along with sharing a solution for and steps on how to achieve consistent fine-dot dispensing.

When the world was moving toward green manufacturing, lead-free soldering – originally driven by RoHS (Restriction on the use of Hazardous Substances in electrical and electronic equipment) of Europe – was becoming the mainstream for the electronics industry, and Sn-rich alloys – including SnAgCu, SnAg, and SnCu – have been prevailing for more than a decade. While the electronics industry keeps advancing rapidly toward miniaturization, two important drivers are dictating the evolution of lead-free solders: low cost and high reliability. In “The Evolution of Lead-Free Solder Alloys,” Presenter Hongwen Zhang will discuss the evolution of lead-free solders after the implementation of lead-free soldering in the industry from 2006, covering: (1) the first generation of high-Ag SAC solders; (2) low Ag/zero Ag Sn-rich solders; (3) high-reliability SAC solders; (4) low-temperature lead-free solders; and (5) high-temperature lead-free bonding materials. Zhang will also discuss the market need, and the pros and cons of the representative materials in each group.

The development of heterogeneous integration, which packs more dies or components into a smaller footprint, requires multiple technological advancements in various aspects of advanced packaging, such as substrate design, interconnect methods, and materials. In this Soldering Material Evolution for Heterogeneous Integration Assembly webinar, presenter Sze Pei Lim will outline trends in various soldering material technology for heterogeneous integration, including solder paste, flip-chip, and ball-attach fluxes.

5G networks began rolling out in 2018. Although the technology is still in its early stages, it is expected that the networks will become faster and connect even more devices than now. The networks are powered by 5G base stations which include active antenna units (AAU), antennas, remote radio units (RRU), and base band units (BBU). In 5G Base Station Introduction: Soldering Challenges and Solutions, Presenter Foo Siang Hooi will provide an introduction to the 5G equipment found in base stations and will incorporate perspectives from materials suppliers and innovators. He will discuss the applications and the associated challenges in base station manufacturing, while providing insights on how to solve these challenges with preforms and other solders.

Implementing high-density assembly in all electronic products requires a lot of considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities; if this is not fully understood, failure is the most probable outcome.

There are many ways to increase the packaging density. However, the use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process and reliability, and the type end-product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end-products will look very similar, but specification limits would be different. And when it comes to material section – and solder paste in particular – the type of end-product plays a big role.

Even with the right solder paste selection, a good assembly process and a quality PCB can still result in component failure, leading to yield losses and extra cost. In this webinar, we will discuss selection of the correct solder paste based on end-product and the need for doing proper root cause analysis before making any material or processes changes.

Los BTCs (Bottom Terminated Components) son componentes cada vez más comunes en la industria electrónica actual y con tendencia a incrementarse debido a su tamaño pequeño, excelente desempeño eléctrico y su habilidad de transferir el calor fuera del circuito integrado (IC).

En esta presentación, Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs), Ivan Castellanos discutirá, como se forman los voids en QFNs y como minimizarlos. También se revisaran otros factores que afectan a los voids, como el diseño del estencil, el grosor (thickness) del estencil, perfil de reflujo, mesh y tipo de polvo de la soldadura y desde luego el tipo de soldadura. Así mismo, se revisara la utilización de preformas de soldadura para minimizar los voids.

Heating PCBs for soldering can cause the substrate and components to potentially warp. This can cause parts to expand and contract, leading to common soldering defects such as HiP/HoP and non-wet opens. High-temperature lead-free soldering made these problems worse. To help solve these issues, interest had grown for low-temperature solders for reflow and selective soldering. However, not all companies have the ability to change the alloys they use. Invited guest speaker, Bob Willis will provide practical insights for common and not so common soldering and assembly problems relating to warpage. Some of the solutions as well as “shop floor tricks” will also be illustrated.

The reliability specifications for the product lifetime validation of electronic assemblies are increasing due to the changing requirements of duration of use (increased cycles) as well as increased service temperatures (125-200°C). This is especially true in high-reliability verticals such as automotive, RF, and industrial applications. This makes the choice of solder materials more critical, as the solder paste attributes have a direct impact on increased product service life reliability requirements. in "Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies," Andreas Karch will discuss the parameters that should be taken into consideration to calculate the service life using the Coffin-Manson model. He will also discuss innovative solder solutions to address the higher thermo-mechanical loads on solder joints due to the increased mission profiles and product lifetime validation requirements.

Gallium-based liquid metal has been used as a thermal interface material (TIM) in niche applications for years. In Innovations in Liquid Metal Thermal Interface Materials, Presenter Miloš Lazić will examine the key challenges and material characteristics that have limited their more widespread adoption despite their high conductivity. He will also identify several material innovations that overcome, or minimize, some of those challenges.

Indium Corporation’s summer internship program is not your average internship. And, to truly understand the unique experience, who better to ask than the interns themselves?

During this Ask the Intern webinar – presented by Marketing Communications Intern Joy Valencia, Indium Corporation’s 2020 summer interns will share their experiences of the whole internship process, from onboarding to everyday work life, as well as their advice for future applicants. The interns come from a variety of disciplines – engineering, marketing communications, human resources, product management, etc. – providing plenty of different perspectives. There will also be a time where viewers can submit their questions to be answered in real-time by the panelists. It will be an opportunity for the surrounding communities and curious students to become more acquainted with Indium Corporation’s summer internship program.

As a successor to 4G, the 5G connectivity network is sure to not only transform technology as we know it, but also provide an entirely new mobile experience for every user. With the development of new technologies, new challenges are sure to follow. The high-speed and bandwidth needed within the 5G connectivity network result in two common issues facing companies that are producing this mobile technology: controlling thermal management of and maintaining strong solder joints in the hardware. In this webinar, Jenny Gallery will discuss the challenges and present solutions that can improve the thermal transfer of high-output lasers, as well as solving the weak joint issue on the gold-rich substrate of gallium nitride (GaN) dies.

There are very good reasons why the industry continues to use no-clean solder paste. However, there are also equally good reasons why a no-clean solder paste may still need additional cleaning. Learn easy-to-follow steps to determine when and how to clean without sacrificing product performance with the joint webinar hosted by Indium Corporation and Kyzen.

The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. The changes we will all experience include the nature of car ownership, how the car is powered, increased safety, and driver automation. Each of these changes is only possible with advances in electronics hardware and systems, electronics assembly, and semiconductor packaging. Indium Corporation’s Dr. Andy Mackie will discuss the impact of these changes on electronics assembly and packaging, and the impact of mission profiles on component and systems level reliability.

En soldadura de baja temperatura, no existe una aleación que cumpla con todos los requerimientos. La temperatura real o actual para condiciones de “baja temperatura” puede tener un rango muy amplio. Además cada producto manufacturado, puede tener diferentes prioridades en relación a las principales propiedades del material. Es importante conocer y entender las limitaciones especificas del proceso y los requerimientos de tiempo de vida de cada ensamble manufacturado. La innovación en soldaduras de baja temperatura ha sido posible gracias a este conocimiento. Durafuse™ LT en un buen ejemplo, que como las propiedades de drop-shock de aleaciones de temperatura medias pueden ser posibles en límite superior de aleaciones de baja temperatura. Acompáñame a considerar las oportunidades y restricciones de soldaduras de baja temperatura.

Due to increasing electrification, especially in automotive power modules and RF communication, it is clear that uniform bondline control between the substrate and baseplate has a direct link to mechanical reliability. An uneven bondline can result in early cracking and solder layer delamination due to stress concentration at the thinner joint areas. In Power Electronics: Improve Bondline Control & Reliability with a Reinforced Matrix Solder Solution, Vijay will examine how InFORMS®, a reinforced matrix solder composite preform (patent-pending ribbon), deliver uniform bondline control and enhancing reliability by a factor of 2X, and achieving the lowest cost of ownership.

Bottom terminated components (BTCs) are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC). In his workshop, Understand and troubleshoot voiding in bottom terminated components, Dr. Lasky will discuss how voids form in QFNs and how to minimize them. He’ll also cover factors that affect voiding, such as stencil design, stencil thickness, reflow profile, solder paste particle size, and solder pastes. The use of solder preforms to minimize voiding will also be presented.

Low temperature soldering is not a one alloy fits all situation. The actual temperature required for “low temperature” applications can vary widely. In addition different products may have very different priorities regarding key properties. Understanding the specific process limitations and lifetime requirements is important for any PCB assembly. But innovation in low temperature soldering has truly highlighted the benefit of such understanding. Durafuse™ LT is a great example of bringing mid-temperature drop-shock properties into the upper edge of the low temperature space. Join me in considering the changing opportunities and restrictions of low temperature solder.

Indium Corporation will host a webinar on liquid metal thermal interface materials.

Why does a D-PAK exhibit more voiding than other types of bottom termination components (BTCs)? In D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding, Flanagan will review voiding results based on an analysis of several process variables, such as adding weights to the tops and cutting off the leads of DPAKs, giving insight into the physics behind DPAK voiding, and providing an answer to the root cause. Her goal is to reveal how to remedy the phenomenon.