Advanced Packaging
Advanced packaging typically refers to a range of innovative techniques in semiconductor packaging technology aimed at enhancing the integration, performance, and miniaturization of electronic devices. It focuses on optimizing and advancing packaging technology, making it crucial to have a partner like Indium Corporation by your side to navigate the challenges effectively.
Overview
Partner with Indium Corporation to Revolutionize the Advanced Packaging Innovation
Advanced packaging techniques enhance semiconductor packaging and assembly by employing sophisticated methods for greater integration and performance. Indium Corporation has been a strategic partner for customers in developing next-generation materials that drive the industry’s progress in advanced packaging.
Related Products
Advanced packaging includes applications such as 2.5D/3D, CoWos, and the requirement is higher.
Fluxes
Wide portfolio of PCBA and semiconductor
Semiconductor Solder Pastes
Proven diverse range of semiconductor solder
Tacking Agents
Tacking agent to reduce fixturing needs and streamline
Thermal Interface Materials
Metal-based TIMs offer low thermal resistance & customizable
Related Applications
Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
Related Markets
Why Indium Corporation
Maximize Your Yield and Potential—Partner With Us Today
As a global leader known for our technical expertise and innovative solutions, we ensure that your products exceed industry standards, offering unmatched performance and reliability. Partner with us to experience cutting-edge technology and exceptional service—the Indium Corporation difference.
Your Success
is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.