Markets Automotive/EV

Automotive/EV

Proven Products. Enhanced Reliability.

The industry’s challenge lies in minimizing or preventing electrical component failures to enhance consumer safety and lower the costs associated with defective electronics. Such failures can stem from various solder defects, including voids, head-in-pillow issues, insufficiencies, slumping, non-wet opens, dendritic growth, cracking, and warpage.

Indium Corporation’s suite of proven, high-reliability materials, from solder paste to solder preforms, thermal interface materials, innovative solder alloys, metals, and compounds offers enhanced performance in automotive electronics assembly and packaging applications.

Features

10 Million+
SIR
IATF16949:2016

Related Applications

Power Electronics Packaging & Assembly

Extensive range of proven high-reliability solder and more

Microchips on a printed circuit board

PCB Assembly

Proven and cutting-edge materials for PCB assembly

Close-up of a computer microchip on a green circuit board with visible electronic components and patterns.

Thermal Management

Thermal solutions for HPC ensuring reliability and optimal

Close-up of a colorful patterned microchip surface with a grid-like structure and a reflective sheen.

Semiconductor Packaging & Assembly

Critical semiconductor packaging ensures functionality and

Maximize Your Yield and Potential—Partner With Us Today

As a global leader known for our technical expertise and innovative solutions, we ensure that your products exceed industry standards, offering unmatched performance and reliability. Partner with us to experience cutting-edge technology and exceptional service—the Indium Corporation difference.