Indium Corporation Announces Innovative New Low-Temperature Alloy Technology
November 21, 2019
Indium Corporation continues to innovate alloy technologies with a new high-performance, high-reliability low-temperature alloy.
Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. Where traditional low-temperature solders often produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT offers improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. Durafuse LT:
- Provides a solution for heat-sensitive components and flex polymers
- Prevents thermal warpage of processor components and multilayer boards
- Meets low-temperature requirements for step soldering, particularly in RF shield attachment and rework applications
To learn more about Indium Corporation’s 200+ alloy products, visit https://www.indium.com/solders/solder-alloys/.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.