Since our founding in 1934, Indium Corporation has been the world’s leader in specialty solders and alloy development. Our R&D staff, including several Ph.D. metallurgists, work with our core set of metals to develop alloys that will address the latest soldering and sealing challenges.
We offer over 220 alloys with melting temperatures ranging from 7–1,064°C.
Our products are focused on six main alloy families: gallium (Ga), bismuth (Bi), indium (In), tin (Sn), lead (Pb), and gold (Au).
Fusible alloys have low-melting temperatures, which is a key property. This allows ease of use in applications such as supporting work pieces during finishing stages. Because of the low-melting point, it is easy to re-melt and remove this sacrificial material after the finishing process.
In some applications, it is the precise location where the melting point of the alloy can be utilized. For example, the melting property of the material can serve as a precise switch when it reaches the desired temperature, such as in sprinkler systems. The same principle has been used in pop-up timers when cooking turkeys.
Alloys that contain gallium have the intriguing property of remaining in the liquid state at room temperature and below. While pure gallium melts at 30°C, alloying gallium with indium, tin, and/or zinc lowers the melting point even further.
Durafuse® LT is a low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C.
Durafuse® LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup. Durafuse® LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse® LT is ideal for high-reliability applications, which utilize thermally-sensitive components or boards and/or have a requirement for step soldering.
Since our founding in 1934, Indium Corporation has been the world’s leader in specialty solders and alloy development. Our R&D staff, including several Ph.D. metallurgists, work with our core set of metals to develop alloys that will address the latest soldering and sealing challenges.
Our alloy selection is based on decades of listening to our customers and finding solutions that enable cutting-edge technologies. Melting temperature ranges from 7–-1,064°C.
Gold-based alloys offer strong bond strength, excellent corrosion and oxidation resistance, and good thermal and electrical transfer at the braze joint. The sSilver brazing alloys have high thermal and electrical conductivity, capillary very well into joints, and holds up well in applications with lots of stress and with CTE mismatches.
Indium Corporation’s QuickSinter® silver sintering pastes are high metal-loading materials designed to fit easily into a dispense process with no change of deposition equipment. The pastes can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces.
Indium Corporation offers recycle and reclaim programs for indium, gallium, germanium, and tin metals, as well as a program for recycling solder and solder dross.
Indium Corporation offers reclaim services for most indium-containing materials including:
Indium Corporation recognizes the need for safe and efficient reclaim of metals used in the soldering process.
Key Benefits:
