Products
Avoid the Void®
Avoid the void and prevent shortened product life, field failures, and customer dissatisfaction with Indium Corporation’s advanced solder paste technology. Our range of solders is formulated to minimize voiding and provide enhanced benefits to address additional process needs, including improved response-to-pauses, stability, reduced head-in-pillow (HiP) defects, reliable in-circuit testing, and superior surface insulation resistance (SIR) performance.
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- Avoid Field Failures
- Eliminate Thermal Problems
- Reduce Customer Complaints
Overview
Avoid the Void® with Indium Corporation’s Advanced Solders
Our Avoid the Void® initiative tackles one of the most critical challenges in electronic assembly: minimizing voiding in solder joints. This approach highlights our commitment to delivering high-quality, reliable soldering solutions by offering solder pastes specifically designed to reduce voiding, optimize processes, and enhance techniques. By collaborating closely with industry partners and customers worldwide, we provide proven and innovative solutions to address this increasingly challenging defect.
Benefits
Maximize Performance, Reliability, and Yield
Enhanced Reliability
With Avoid the Void®, electronic assemblies achieve enhanced mechanical and thermal stability, minimizing the risk of joint failures under stress.
Improved Performance
Achieve better heat dissipation and electrical conductivity with fewer voids, ensuring optimal performance in demanding applications.
Efficient Manufacturing
By optimizing solder paste formulations, reflow profiles, and processes, Avoid the Void® streamlines manufacturing, reduces rework, and boosts production yields.
Lower Cost of Ownership
Avoid the Void® delivers improved performance, enhanced reliability, and higher yields, enabling customers to lower their cost of ownership while meeting industry quality standards.
Avoid the Void® Solder Pastes
Many of our solder pastes are designed to reduce voiding while providing other benefits. Our best-selling Indium8.9HF Series provides many low-voiding options such as Indium8.9HFRV, a new formula specifically designed for high-reliability alloys.
Solder Preforms
We have many solder preform products that can help reduce voiding, led by the flux-coated preform LV series.
Years of Expertise
Our resource library offers a wealth of resources, including papers, literature, webinars, videos, and blogs on voiding and strategies to reduce it, helping our customers overcome this challenge.
Avoid the Void® Products
Avoid the Void® includes a series of voiding reduction products, from solder paste to preforms.
Solder Pastes
Discover the wide selection of PCBA & semiconductor solder
Solder Preforms
Solder preforms: versatile materials solving sealing & thermal
Gold Solder
Premium gold solder solutions for high-temp, high-reliability
Fluxes
Wide portfolio of PCBA and semiconductor
Related Applications
Avoid the Void® products help prevent defects in a variety of applications.
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
High-Reliability
Various options for various high-reliability PCBA
Related Markets
Avoid the Void® has successfully assisted numerous customers across various industries in enhancing performance, reliability, and yield.
Related Products
Indium8.9HF Series
Best-selling solder pastes for high performance &
AuLTRA® 75
Off-eutectic gold-alloy preforms, engineered for high-reliability die-attach
Gold-Alloy Ribbon
Durable, high-performance gold-alloy ribbon for precision
AuLTRA® Fine Wire
Gold-Alloy Wire AuLTRA® Fine Wire Indium Corporation’s AuLTRA® Fine Wire is a precision, high-reliability gold-tin wire suitable for medical, aerospace, and other critical applications. Our
Expert Support for Reliable Results
Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!
Minimizing Graping
Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to
Webinar on Voiding June 11, 9AM and 2PM EST
Folks, I will be presenting a workshop on “Understanding and Troubleshooting Voiding in Bottom Terminated Components (BTCs)." BTCs are one of the most common components in use today. If
Starvation Voids: When too little (paste) becomes too much (voiding)
When I was first introduced to QFN voiding, it appeared to be a straightforward issue: outgassing from flux creates pockets of entrapped air causing reliability problems. But I’ve since come to
Avoid The Void™ – Identifying Causes of Die-Attach Soldering Voids
“How do I reduce my die-attach soldering voids?” is a question I am often asked by customers in the power semiconductor
SCOOPstudio Roundtable – Avoiding Voids, Clinic Outcomes – APEX 2019
MB Allen, Product Manager at KIC and Kim Flanagan, Technical Support Engineer at Indium Corporation joined SCOOP’s Philip Stoten to share the clinic’s outcomes and offer their own insight
Avoiding the Void in Flux-Cored Solder Wire
My colleague, Eric Bastow, participated in a videocentered on voiding in flux-cored solder wire a few years ago; the information he presented is still very relevant
Tech Seconds: Troubleshooting Voiding
Indium Corporation’s Tech Seconds video series features Phil Zarrow answering the electronics assembly industry’s most commonly asked questions… in less than 60 seconds. In this
Tech Seconds: Voiding – Symptom or Defect?
Indium Corporation’s Tech Seconds video series features Phil Zarrow answering the electronics assembly industry’s most commonly asked questions… in less than 60 seconds. In this
Stages of a Reflow Profile: Part II
In my last post, Stages of a Reflow Profile: Part I, I discussed how thespattering of solder balls and solder paste slumping can occur in the beginning stages of a reflow profile. In this post I will
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