Compounds

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

Folks, A few weeks ago, I found this note in my email in box: Dear Dr. Ronald C Lasky, Good Morning! Well, we are in shortfall of article for successful release of Upcoming Issue of our XXX

Phil Zarrow: Robert, the industry standard for process characterization is Cpk, and sometimes Cpu; Dr. Lasky has discussed this as it pertains to assembly processes. With regard to materials,

No one likes being controlled by the cost of silver. We deal with fluctuating Ag costs here at Indium Corporation on a very large scale – so I understand the issues with using Ag-filled low

Folks, Peg writes: If the RoHS sweep does not scare you as a company, just wait for the REACH sweeps and SVHC list. RoHS is the tip of the iceberg and paved the way for the much larger REACH program

I read your article "RoHS: The Fine Print" with interest. Your point about chromium in screw plating points out the level of detail with which this issue needs to be addressed. I have been