Solder preforms
Solder Fortification®
Solder Fortification® preforms are flux-free rectangular alloyed metal pieces designed to enhance solder joints by seamlessly integrating with solder paste during reflow. Sharing the same alloy as the paste, they reflow together using the paste’s flux, ensuring optimal adhesion and flow. These preforms significantly increase solder volume, making them ideal for fine-pitch applications (0.3mm or smaller) where robust, reliable connections are critical.
Powered by Indium Corporation
- Stronger Solder Joints
- Reduced Rework
- Increased Solder Volume
Product Overview
Solder Fortification® preforms are packaged in tape and reel for easy placement by standard pick and place machines.
Common Alloys:
- SAC305
- SAC387
- Sn63
- Sn62
| Name | Size | Quantity Per Reel 7″ | Quantity Per Reel 13″ | Example Weight: SAC305 (grams/ea) | SAC 305 | SnPb |
|---|---|---|---|---|---|---|
| 0201H | 0.010″ x 0.020″ x 0.005″ (0.254mm x 0.508mm x 0.127mm) | 1k | 50k | 0.00012 | ✓ | n/a |
| 0201 | 0.010″ x 0.020″ x 0.010″ (0.254mm x 0.508mm x 0.254mm) | 1k | 50k | 0.00024 | ✓ | ✓ |
| 0402B | 0.020″ x 0.040″ x 0.004″ (0.508mm x 1.01mm x 0.101mm) | 1k | 15k | 0.00039 | ✓ | n/a |
| 0402H | 0.020″ x 0.040″ x 0.010″ (0.508mm x 1.01mm x 0.25mm) | 1k | 15k | 0.00096 | ✓ | n/a |
| 0402 | 0.020″ x 0.040″ x 0.020″ (0.508mm x 1.01mm x 0.48mm) | 1k | 15k | 0.00182 | ✓ | ✓ |
| 0603H | 0.030″ x 0.060″ x 0.015″ (0.76mm x 1.52mm x 0.381mm) | 1k | 15k | 0.00325 | ✓ | n/a |
| 0603 | 0.030″ x 0.060″ x 0.030″ (0.76mm x 1.52mm x 0.787mm) | 1k | 15k | 0.00672 | ✓ | ✓ |
| 0805H | 0.050″ x 0.080″ x 0.030″ (1.27mm x 2.03mm x 0.762mm) | 1k | 10k | 0.01444 | ✓ | n/a |
| 0805 | 0.050″ x 0.080″ x 0.050″ (1.27mm x 2.03mm x 1.27mm) | 1k | 10k | 0.0241 | ✓ | ✓ |
| 1206 | 0.060″ x 0.120″ x 0.060″ (1.52mm x 3.05mm x 1.52mm) | 1k | 7.5k | 0.0521 | ✓ | ✓ |
Features
Achieving precise solder joints is essential for reliability in electronics manufacturing. However, miniaturization trends, such as reduced stencil thickness and tighter component spacing, make this increasingly complex. Solder Fortification® preforms provide an advanced solution to effectively meet these demanding requirements.
Edge Connectors
Edge connectors endure frequent mechanical stress from plugging and unplugging, making durable solder joints essential for reliability. Adding solder preforms increases solder volume, creating stronger, more resilient joints to withstand repeated use.
Through-Hole Solder Joints
Through-hole solder joints can be costly with wave soldering, while solder paste alone may struggle to achieve complete hole fill. Adding solder preforms increases solder volume, improving strength and reliability, especially for servers, telecommunications, and automotive applications.
Quad-Flat No Lead (QFN) Void Reduction
Voiding under QFN components is a major thermal reliability challenge caused by volatiles in solder paste. Solder preforms, free of flux and volatiles, significantly reduce voiding, ensuring more reliable solder joints compared to paste alone.
Radio Frequency Shielding
RF shields require a complete solder joint to ensure they are securely attached to the board. Traditional stencil printing often falls short in delivering the necessary solder volume for a full joint around the shield. Adding solder preforms significantly increases solder volume, ensuring a reliable, robust connection compared to solder paste alone.
Product Data Sheets
Solder Fortification® Preforms PDS 98552 (A4) R7.pdf
Solder Fortification® Preforms PDS 98552 R7.pdf
Solder Fortification Preforms PDS 99426 (SC A4) R0.pdf
Solder Fortification® Preforms PDS 98552 (MS A4) R7.pdf
Related Applications
PCB assembly preforms are suitable for a wide range of applications.
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
Related Markets
Indium Corporation’s PCB assembly preforms are available for use in a variety of markets.
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