Thermal Interface Materials
Solder TIM (sTIM)
High-power density devices demand top-tier thermal interface materials. Phase-change materials, graphites, polymer-based TIMs, and greases cannot meet the reliability, thermal, and warpage requirements of high-performance devices. As the leading global provider of sTIM solutions, Indium Corporation offers expertise in integrating sTIM into your process, backed by our skilled engineers and trusted equipment partners.
Powered by Indium Corporation
- Highly Automated Global Manufacturing Sites with Stable, Long-Term Supply Chain
- Automated Global Manufacturing Sites with Stable Supply Chains
- Alloys and Sizes for Advanced Packaging Needs
Product Overview
High Thermal Conductivity
Indium has a high bulk thermal conductivity (86 W/m-K), which means less sensitivity to bondline thicknesses and coplanarity issues compared to polymer-based TIMs.
TIM1 and TIM1.5 sTIM Solutions
Indium and indium-based alloys are available for single and multiple reflow processes, designed for maximum wetting to various metallizations with minimal voiding.
Long-Term Reliability
Indium’s ductility and ability to absorb mechanical stress make it more reliable than traditional solders in applications that involve thermal cycling or mechanical strain.
Sustainable
Indium is recyclable and reclaimable, reducing energy consumption in the reflow process with a low melting temperature (157ºC) and allowing reflow without negatively impacting assembly.
Solder TIM Products
| Properties | Indium | 90In10Ag |
|---|---|---|
| Liquidous | 157°C | 237°C |
| Solidus | 157°C | 143°C |
| Tensile Strength | 386 PSI | 1710 PSI |
| Shear Strength | 890 PSI | 1600 PSI |
| Youngs Modulus (PSI x 106) | 1.73 | 2.5 |
| Elongation | 67% | 38% |
| Thermal Conductivity | 86 W/m-K | 71 W/m-K |
Product Data Sheets
Solder Thermal Interface Materials for BGA Packages PDS 100082 (A4) R1.pdf
Solder Thermal Interface Materials for BGA Packages PDS 100082 R1.pdf
Related Applications
TIM1, TIM1.5, TIM2
Metal-based TIMs deliver high thermal performance and
Thermal Management
Thermal solutions for HPC ensuring reliability and optimal
Package-Attach
Wide selections to address the challenges in
Related Markets
Related Products
Heat-Spring®
A renowned soft metal alloy thermal interface
Liquid Metal and Liquid Metal Paste
Liquid metals that are RoHS-compliant and
Phase Change Metal TIMs
Discover the advantages of PCMA TIMs over liquid
Solder Alloys
Wide range of solder alloys with melting temperatures
Expert Support for Reliable Results
Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!
Metal TIMs 101: Chapter 2
Folks, A short time ago,I posted"Metal TIMs 101: Chapter 1" with Jon Major. Now it is time for Chapter 2! Dr. Ron: Jon, what is TIM1.5? Jon: TIM1.5 commonly refers to the interface between
Metal TIMs 101: Chapter 1
Folks, Dr. Ron: For my next several posts, I would like to chat with Indium Corporation’s metal thermal interface materials (TIMs) Product Manager, Jon Major, about metal TIMs. Jon, can you
Development of Innovative Advanced Packaging Materials for System in Package
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous
Minimizing Graping
Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to
IMAPS 2015: International Symposium on Microelectronics
The 48th International Symposium on Microelectronics (IMAPS) was held in Orlando, FL, USA last month, from October 26th through the 29th, 2015. I was able to attend as both as an exhibitor and as a
Controlling Junction Temperature of LEDs with Thermal Management Materials
The junction temperature in an LED (the p-n junction temperature) is most critical to consider for LED cooling.If this temperature rises above the prescribed level recommended by the LED
Other Benefits of a Good Solder Joint
Proper solder joints provide mechanical, electrical, and thermal interconnections that are reliable over the course of a product’s lifespan. Unreliable interconnections not only cause product
Indium Bonding and Indium Cold Welding
In recent days, one of my fellow applications engineers, Jim Hisert posted a blog on his semiconductor website about indium bonding and indium cold welding. This is a topic that comes up often both
Applying TacFlux® to a Solder Thermal Interface Material
The process of applying a solder thermal interface material typically includes applying flux to a solder preform and reflowing it in a sandwich between two substrates. When a preform comes flux
Looking for Safety Data Sheets?
Access everything you need — from technical specifications to application guidance — in one convenient location.
Your Success
is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.