Search Results for "InTACK"
- PRODUCT DATA SHEET InTACK - Indium Corporation : InTACK® is dispensed to affix a Heat-Spring® or solder preform into position. Once in place, InTACK® reduces the thermal resistance of the compressed thermal interface it is used with. InTACK® assists with alignment and attachment to ICs in TIM2 applications or to burn-in test heads, providing a strong bond and extended working time, ma ...
[URL] https://www.indium.com/technical-documents/product-data-sheets/download/5225
- Search | Indium Corporation : PRODUCT DATA SHEET InTACK - Indium Corporation: InTACK is dispensed to affix a Heat-Spring® or solder preform into position. Once in place, InTACK reduces the thermal resistance of the compressed thermal interface it is used with. InTACK assists with alignment and attachment to ICs in TIM2 applications or to burn-in test heads, providing a ...
[URL] https://www.indium.com/search/?q=InTACK
- PRODUCT DATA SHEET InTACK - Indium Corporation : InTACK is dispensed to affix a Heat-Spring® or solder preform into position. Once in place, InTACK reduces the thermal resistance of the compressed thermal interface it is used with. InTACK assists with alignment and attachment to ICs in TIM2 applications or to burn-in test heads, providing a strong bond and extended working time, ma intaining ...
[URL] https://www.indium.com/technical-documents/product-data-sheets/download/5224
- Die-Attach - Indium Corporation : InTACK ™ is a no-clean, no-residue, halogen-free material designed to affix solder preforms, chips, or dies in position after placement to prevent skewing and misalignment during power module manufacturing. It provides a strong bond and extended working time, maintaining its tacking properties throughout the assembly process and up to the ...
[URL] https://www.indium.com/applications/semiconductor-packaging-and-assembly/die-attach
- PRODUCT DATA SHEET InTACK01 - indium.com : InTACK®01 is a no-clean, no-residue, halogen-free material designed to affix solder preforms, chips, or dies in position after placement to prevent skewing and misalignment during power module manufacturing. It provides a strong bond and extended working time, maintaining its tacking properties throughout the assembly process and up to the ...
[URL] https://www.indium.com/technical-documents/product-data-sheets/download/5247
- Indium Corporation Introduces New Adhesive Solution for Semiconductor ... : InTACK™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost ...
[URL] https://www.indium.com/corporate/media-center/news/indium-corporation-introduces-new...
- InTACK®02 Robust Tacking Agent for Power Electronics Assembly PDS ... : %PDF-1.4 %âãÏÓ 4 0 obj > endobj xref 4 50 0000000016 00000 n 0000001533 00000 n 0000001641 00000 n 0000002869 00000 n 0000003474 00000 n 0000004011 00000 n 0000004919 00000 n 0000006508 00000 n 0000007765 00000 n 0000008162 00000 n 0000009290 00000 n 0000010521 00000 n 0000011789 00000 n 0000013026 00000 n 0000013958 00000 n 0000014071 00000 n 0000014183 00000 n 0000014294 00000 n ...
[URL] https://www.indium.com/technical-documents/product-data-sheets/download/5249
- English Product Data Sheet Library - Indium Corporation : InTACK®01 Robust Tacking Agent for Power Electronics Assembly ; InTACK®02 Robust Tacking Agent for Power Electronics Assembly ; InTACK™ Robust Tacking Agent with Heat-Spring® Indalloy® 133 for Preforms ; Indalloy® 301-LT for Preforms/InFORMS®
[URL] https://www.indium.com/technical-documents/product-data-sheets/english
- Webinars | Media Center | Indium Corporation : An emerging material technology, InTACK™, can be applied during assembly to provide robust tacking strength and reduce the dependency on customized fixturing. The absence of residue and contamination with InTACK™ make this a viable option for flux-free soldering and sintering applications where cleanliness directly influences reliability ...
[URL] https://www.indium.com/corporate/media-center/webinars/view/view/InTACK-tm-Material...
- Indium Corporation to Showcase High-Reliability Products for Power ... : InTACK ™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost ...
[URL] https://www.indium.com/corporate/media-center/news/indium-corporation-to-showcase-high...
- PRODUCT DATA SHEET InTACK02 - Indium Corporation : InTACK 02 is an SVHC-free, no-clean, no-residue, halogen-free material designed to affix solder preforms, chips, or dies in position after placement to prevent skewing and misalignment during power module manufacturing. It provides a strong bond and exten ded working time, maintaining its tacking properties throughout the assembly process and ...
[URL] https://www.indium.com/technical-documents/product-data-sheets/download/5250
- Webinars | Media Center | Who We Are | Indium Corporation : An emerging material technology, InTACK™, can be applied during assembly to provide robust tacking strength and reduce the dependency on customized fixturing. The absence of residue and contamination with InTACK™ make this a viable option for flux-free soldering and sintering applications where cleanliness directly influences reliability ...
[URL] https://www.indium.com/corporate/media-center/webinars/access/InTACK-tm-Material...
- Video: InTACK - Indium Corporation : Precise assembly alignment is required to ensure long-term reliability and consistent quality. InTACK™ is the drop-in toolless solution for power module assembly offering precise alignment, resulting in reduced work steps. Switch to Indium Corporation’s InTACK™ Technology today.
[URL] https://www.indium.com/corporate/media-center/videos/InTACK-technology-the-solution...
- Indium Corporation to Showcase Innovative Solutions for Thermal ... : InTACK ™—a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the dependency ...
[URL] https://www.indium.com/corporate/media-center/news/indium-corporation-to-showcase...
- Indium Corporation to Showcase High-Reliability Materials for Power ... : InTACK ™ – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the ...
[URL] https://www.indium.com/corporate/media-center/news/indium-corporation-to-showcase-high...
- Indium Corporation to Participate at 3D-PEIM, Feature Innovative ... : InTACK ™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost ...
[URL] https://www.indium.com/corporate/media-center/news/indium-corporation-to-participate...
- Indium Corporation Honored with Two Global Technology Awards at ... : InTACK™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost ...
[URL] https://www.indium.com/corporate/media-center/news/indium-corporation-honored-with-two...
- Indium Corporation to Feature Innovative Materials for Power ... : InTACK ™ – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the ...
[URL] https://www.indium.com/corporate/media-center/news/indium-corporation-to-feature...
- Indium Corporation to Feature Durafuse® Solder Technology, EV Products ... : InTACK ® – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. QuickSinter ® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput.
[URL] https://www.indium.com/corporate/media-center/news/indium-corporation-to-feature...
- Product Videos | Media Center | Indium Corporation : InTACK ™ Technology: The Solution for Power Module Assembly Tooling. InFORMS® for Power Module Reliability. Rel-ion™: The Future of EV is Here. Driving e-Mobility: Rel-ion™ Technical Webinars. AuLTRA ™ ThInFORMS ™ for Die-Attach Applications. Achieve Better Dispensability with Indium12.8HF Jetting/Microdispensing
[URL] https://www.indium.com/corporate/media-center/videos/products.php