Read this post in: English only Tags: Category: Indium Corporation Posted On: April 1st, 2009 “Through-wafer Inspection for MEMS Devices – a Comparison” is the second feature article from the last edition of Advanced Packaging Magazine. In this article, Axel Eschenburg and Taufiq Habib of Viscom AG discuss using near-infrared light to inspect wafer-to-wafer bonding, as opposed to acoustic imaging, long-wave, or x-ray. Authored by previous Indium Application Manager Jim Hisert