Posted On: March 12th, 2020 | By: Indium Corporation®

Starvation Voids: When too little (paste) becomes too much (voiding)

Diving deeper into exploring the types of voids and how they occur, some important interactions between material and process variables appear....

Posted On: February 26th, 2020 | By: Adam Murling

Solder Fortification Preforms Revisited

Using Solder Fortification preforms to fix starvation voids caused by plated vias in the ground pad design....

Posted On: March 11th, 2019 | By: Dean Payne

Avoid The Void™ - Identifying Causes of Die-Attach Soldering Voids

“How do I reduce my die-attach voids?” There is no sliver bullet, but here is a process to help you identify and reduce your voiding....

Posted On: August 21st, 2018 | By: Phil Zarrow

Tech Seconds: X-ray Analysis Electronics Assembly

In this installment of Tech Seconds, Phil discusses the basics of X-ray analysis for electronics assembly and how to identify soldering voids....

Posted On: August 7th, 2018 | By: Phil Zarrow

Tech Seconds: Troubleshooting Voiding

In this installment of Tech Seconds, Phil outlines how to effectively troubleshoot voiding issues when a customer notices an increase in the amount of...

Posted On: July 31st, 2018 | By: Phil Zarrow

Tech Seconds: Voiding - Symptom or Defect?

How do you determine whether your voids are a symptom or a defect. Phil Zarrow gives his advice. ...

Posted On: July 24th, 2018 | By: Phil Zarrow

Tech Seconds: How to Interpret Ion Chromatography (IC) Results

What should you consider them you analyze ion chromatography results? ...

Posted On: July 17th, 2018 | By: Phil Zarrow & Indium Corporation®

An Overview of Vacuum Reflow Soldering

Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow, discuss approaches for reaching near zero voiding and how v...