邱学丞服务于铟泰中国华东区。采访他会是个从另一个角度去认识半导体行业的绝好机会。
Jim: How long have you been involved in the semiconductor industry in
吉姆：你在中国从事半导体行业多久了？
Michael: I have been in the semiconductor industry in
邱学丞：有三年多了。在这之前我花了四年时间在上海某大学学习IC设计、制造 (Fab)和封装。
Jim: What semiconductor materials are most popular for your customers?
吉姆：在你的客户中哪些半导体材料用的比较多？
Michael: For some semiconductor package customer, silver epoxy is very popular applied to do die attach. As for high power device, paste/SSDA is used popular for die attach. But for some advanced customers who do BGA, FC and WLCSP business, flux or fine power paste is required.
邱学丞：在一些封装厂里，银浆被大量地用来贴芯片于框架上。对那些做大功率器件的客户来说，锡膏或者焊线用来贴芯片比较普遍。而那些做BGA, FC和WLCSP的客户，他们需要的则是助焊剂或者精细颗粒锡膏。
Jim: What trends do you see in semiconductor package manufacturing in
吉姆：你觉得中国半导体封装的趋势如何？
Michael: For [cost sensitive] customers who do Diodes/Transistor package, the manufacture cost will be more and more important.
BGA/FC/CSP package share will increase soon in the near future and more factories will be able to do those packages.
More advanced package like SIP (system in a package) and MCM (multi-chip module) will [become] popular, but this may take several years.
邱学丞：对那些制造二极管或三极管的客户来说，成本对竞争力非常重要。他们对材料的成本以后会愈加敏感。在封装市场中，BGA/FC/CSP市场份额会有迅速的增长，而且会有更多的厂家能做这些封装。还有一些更高端的封装技术，比如SIP (system in a package) 和MCM (multi-chip module) 会开始流行，当然这得花个好几年时间。
Jim: What topics would our customers in
吉姆：中国的客户希望在半导体封装博克上看到什么样的话题？
Michael: Our customers always hope to get our professional technical support. They prefer the blog on a particular application or issue. For example, comparison between In and AuSn in LD die attach and use dilute hydrochloric acid to remove oxidation layer on In preforms.
邱学丞：我们的客户总是会希望能得到更好的专业支持。他们会比较喜欢主题明确，针某个具体应用或者问题的一些文章。比如：“LD芯片贴装应用中In和AuSn的对比”和“用弱盐酸去除铟焊片表面的氧化物”。
Jim: What is the most exciting thing about the semiconductor industry to you?
吉姆：半导体行业中什么东西最让你觉得激动？
Michael: A chip which is smaller than your nail has so many functions.
邱学丞：一个比你指甲还小的芯片能拥有如此多的功能，这太迷人了。