上週在美國的拉斯韋加斯(Las Vegas), IPC舉辦了美國地區行業的盛會APEX. Indium公司一如既往的在展會中心安排展位，和業界各位舊友新友交流，與大家分享最新的產品和技術，傾聽大家的反饋和聲音。
除此，在人山人海的技術會議交流中心(paper presentation, educational workshop)，Indium公司的五位大將還為大家做了精彩的演講：
- Ning-Cheng Lee, Ph.D, Vice President of Technology 李寧成博士：
² Lead-Free Flux Technology and Influence on Cleaning.
² Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly.
² Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints Via Mn or Ce Doping.
- Ronald C. Lasky, Ph.D. PE, Senior Technologist
² Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration
- Mario Scalzo, Senior Technical Support Engineer
² Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly.
² Challenges for Implementing a Halogen-Free Process
- Eric Bastow, Senior Technical Support Engineer
² Understanding SIR
- Chris Anglin, Applications Development Engineer
² Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste
Cheers!
