Common Ball Grid Array Failures and How to Avoid Them
The BGA ball-mount process may seem uninteresting and trivial at first glance. However, the soldering steps are complex and can lead to problematic fa...
Ball Attach
Ball-Attach Flux: WS-575-C-RT (VIDEO)
Currently, for the ball-attach process, customers are facing issues like warpage of the substrates......
One-Step OSP BGA Soldering Application
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex...
Tech Spotlight: Maria Durham
While not directly part of Indium Corporation’s Technical Service department, Maria is technology driven and works with our customers to help se...
IMAPS 2013: International Symposium on Microelectronics
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending b...
Ball-Attach Flux WS-446-NRD for Poor Quality OSP-wetting
While on a recent trip to Malaysia, I interviewed two colleagues regarding trends in semiconductor assembly. My previously-published interview with Sz...
Solder Paste and Flux Dip Depth: I
My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-pac...
Colored Fluxes: Not Child's-Play
One of the first activities any child enjoys, once they can manipulate things, is using paints and crayons to color pictures. Stay with me: ...
Package-on-Package (PoP) Solder Paste
A quick trip to discuss roadmapping with one of the world’s top processor manufacturers, and a visit to discuss Pb-free power die-attach materia...
Unique Solderspheres
Solderspheres or solder spheres, or even solder balls: whatever you call them, Indium Corporation has been making them for years and has rightly acqui...
Inextricably Intertwined
A passage from Metals Handbook, Volume 6, 1983Ӕ According to the Encarta Dictionary that......