There are many factors that determine bump height. One key aspect of bump height is bump co-planarity or the uniformity of height from bump to bump across a wafer.ւ The most effective way to ensure each bump is of similar height is to control solder volume. Volume of solder can be controlled in the wafer printing process by choosing a high quality bumping paste and optimizing printer settings.
Authored by previous Indium Application Manager Jim Hisert