This video is for people who are manufacturing increasingly, miniaturized assemblies and facing thermal, and/or mechanical drop shock challenges. It will tell you about methods from improving the electrical, mechanical, and thermal reliability of electronics assemblies.
Keywords: manufacturing, miniaturized assemblies, thermal, mechanical, drop shock challenges, thermal reliability, electronics assemblies, IMAPS, IMAPS 2015, improving, electrical, process engineers, electronics, weibull plots, material selection, consumer electronics, components, functionality, solder joints, processors, boards, heat dissipation, thermal management, technical information, tjensen@indium.com, Indium, Indium Corporation, Indium.com, Tim Jensen, Phil Zarrow, From One Engineer To Another