Minimizing Graping
Folks, This post is an excerpt on graping, from Indium Corporation's The Printed Circuits Assemblers Guide to Solder Defects. Intr...
Graping
Lead Free 2015
Folks, It is hard to believe that in July we will celebrate the 9th anniversary of the advent of RoHS. So the timing seemed right when I was recently ...
The Largest Trade-off in Printing UltraFine Solder Pastes is in Reflow
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, espe...
SMT Optimization for Success Part 3: Flux Chemistry
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the t...
Stencil Printing for Success: Solder Paste Handling and Storage
SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the ste...
The Importance of Oxygen Barrier in Solder Pastes
Folks, Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste.&nb...
El defecto de "graping"
En la actualidad en nuestros procesos de ensamble de SMT utilizamos aleaciones libres de plomo (Pb-Free), las cuales requieren temperaturas de proceso...
Has Lead-Free RoHS Compliant Assembly Reliability and Cost "Arrived?"
Folks, I was at APEX 2013 San Diego this past week. San Diego is a great venue for the show, but I always forget how cold it can be (55-65°F...
Addressing a Defect of Poor wetting and Non-Spread of Solder Preforms
We’ve heard about the solder paste “graping” defect, but the same oxidation challenge occurs in other solder forms as well, such as ...
Statistically Significant vs Practically Significant Results in SMT Assembly
Folks, Everyday, we are exposed to the results of surveys and polls. A typical example might be that President Obama is leading Mitt Romney in a...