Posted On: August 28th, 2018 | By: Phil Zarrow

Tech Seconds: How to Troubleshoot Head-in-Pillow (HIP) Defects

In this installment of Tech Seconds, Phil examines the best methods used to troubleshoot head-in-pillow (HIP) defects ...

Posted On: August 14th, 2018 | By: Phil Zarrow

Tech Seconds: How to Eliminate Head-in-Pillow (HIP) Defects

In this installment of Tech Seconds, Phil describes how to diagnose defects caused by head-in-pillow (HIP). ...

Posted On: September 6th, 2017 | By: Phil Zarrow & Indium Corporation®

SMTAI 2017: Warpage-Induced Defects Panel & Show Overview

Brook Sandy-Smith and Phil Zarrow preview some of the events they are looking forward to at SMTAI 2017 ...

Posted On: July 1st, 2016 | By: Phil Zarrow

Introduction to Head-in-Pillow and Non-Wet Open Defects In Electronics Assembly

This video is for anyone interested in mitigating head-in-pillow and non-wet open defects. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, head-...

Posted On: January 22nd, 2016 | By: Indium Corporation®

In Soldering, What is an NWO?

An NWO is a defect where the paste goes with the ball on a BGA and does not wet to the board pad....

Posted On: June 1st, 2015 | By: Dr. Ron Lasky

Lead Free 2015

Folks, It is hard to believe that in July we will celebrate the 9th anniversary of the advent of RoHS. So the timing seemed right when I was recently ...

Posted On: January 5th, 2015 | By: Ed Briggs

The Largest Trade-off in Printing UltraFine Solder Pastes is in Reflow

In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, espe...

Posted On: June 19th, 2014 | By: Ed Briggs

Stencil Printing for Success: Solder Paste Handling and Storage

SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the ste...

Posted On: January 13th, 2014 | By: Dr. Ron Lasky

The Importance of Oxygen Barrier in Solder Pastes

Folks, Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste.&nb...

Posted On: November 18th, 2013 | By: Iván Castellanos

El defecto de "graping"

En la actualidad en nuestros procesos de ensamble de SMT utilizamos aleaciones libres de plomo (Pb-Free), las cuales requieren temperaturas de proceso...