“The standard process was used as described: The pieces were assembled with a reactive multilayer foil between the aluminum and molybdenum, with a compliant foam layer over them and an aluminum spacer block on top of the foam. This stack was loaded into a hydraulic press and compressed to 3MPa. An electric pulse was directed to 4 locations around the bond area to activate the foil and the bond was completed within a fraction of a second.”
If you’ve been following this blog, you know the procedure by now. This is the NanoBond® process, and it was used on all of the samples created for the Eliminating Bond Stresses of Sputtering Targets at Operating Temperatures paper at this year’s SVC (Society of Vacuum Coaters) TechCon.