Starvation Voids: When too little (paste) becomes too much (voiding)
Diving deeper into exploring the types of voids and how they occur, some important interactions between material and process variables appear....
Pb-Free Solder
High Temperature, Pb-free Die-Attach Material Project Webinars - iNEMI
On April 14th, iNEMI will host two webinars for the purpose of discussing a new project geared toward High Temperature, Pb-free Die Attach Materials....
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II
As we discussed in part I of this three-part series, uneven solder bondline thickness between the substrate and baseplate of an IGBT module can cause ...
Changing the Composition of Your Tin-Lead Solder Pot
In today’s electronics manufacturing industry, many companies are using lead-free solder alloys. However, there are a few sectors in the industr...
Growing Interest in Bi-Containing Solder Alloys: Bismuth Rocks!
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders...
The Largest Trade-off in Printing UltraFine Solder Pastes is in Reflow
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, espe...
ELV 2014: High-Lead (Pb) in Automotive Electronics is Good until at Least 2023
Those of you who have been watching this blog for a while - waiting for updates on the European ELV (End of Life Vehicle) legislation - wait no m...
Dartmouth Student Asks Questions About SACm® Solder Alloy
Folks, Some years ago, a leading IC manufacturer decided that their R&D effort could benefit if analyzed for possible improvement – by hirin...
Bi/Sn/Ag: The Perfect Tabbing Ribbon Coating Solder Alloy?
Let’s quickly review the advantages of Bi/Sn/Ag alloy tabbing ribbon coating before we discuss them further: Low temperature melting point Pb-fr...
NanoFoil® for LED Manufacture
NanoFoil® is especially well-suited for bonding LED packages. Here are some characteristics of the NanoBond® Process that fit high v...
High Temperature (Braze Alloy) Sputtering Target Bonding, with NanoFoil®
In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at t...
Thermal Cycling Performance of SACm® Pb-Free Solder Alloy
The development of SACm® lead-free solder alloy by Indium Corporation’s R&D team was focused around improving the mechanical shock perfo...